Through Hole PCB Assembly FR4 Material IC pre-programming / Burning
on-line Conformal coating Green Solder Mask Rohs CE
Huaswin specialized in PCB manufacturing and and PCB Assembly
PCBA capabilities:
FR-4, TG170,14-layer HDI+PCBA
- Fast prototyping
- High mix, low and medium volume build
- SMT MinChip:0201
- BGA: 1.0 to 3.0 mm pitch
- Through-hole assembly
- Special processes (such as conformal coating and potting)
- ROHS capability
- IPC-A-610E and IPC/EIA-STD workmanship operation
PCB Assembly services:
Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic
communications, computers, household appliances, appliances, SD
cards, SG cards, mobile phones, antennas, computers, automobiles,
music equipment, playback equipment, banking equipment, medical
instruments, medical equipment, medical equipment, aerospace,
Aviation, military, LED, OLED, OLCD power control power supply,
industrial power supply, communication power supply, automotive
power supply, office equipment, digital products, computers and
other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone,
connector, module, walkie-talkie antenna card, high-end camera,
digital, camera, laser head, CD, medical, instrumentation, drive,
automotive instrumentation, medical instrument , Medical equipment,
banking equipment, industrial instruments, LED strips, military
industry, aviation, aerospace, national defense and other high-tech
products, more than 70% of the products are exported to the
Americas, Europe, Japan, Asia Pacific and other countries and
regions.
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Detailed Specification of PCB Manufacturing
| 1 | layer | 1-80 layer |
| 2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG,M6,lsola,3M
Polyimide,
Aluminum-based
material. |
| 3 | Board thickness | 0.2mm-6mm |
| 4 | Max.finished board size | 800*508mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | min.line width | 0.075mm(3mil) |
| 7 | min.line spacing | 0.075mm(3mil) |
| 8 | Surface finish | HAL, HAL Lead free,Immersion Gold/
Silver/Tin,
Hard Gold, OSP |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | standard carton packing |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 |
| 15 | Profiling punching | Routing,V-CUT,Beveling |
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil,
cable assembly etc)
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available.
Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the
electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion
caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of
all components, electromechanical parts,
plastics, casings and print & packaging material
Testing Methods
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI
minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949
Design file format:
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)
Advantages:
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities
