Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure FR 4

Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure HDI Printed circuit board pcb

18-layer third-order, 5G high-frequency mixed-pressure HDI
1:5G communication network products
2: FR-4, TG170+ Panasonic M6, third-order soft and hard combination, minimum line width 3/3mil, minimum hole 0.10mm, blind hole, immersion gold, black oil, white
3: plate thickness 1.8mm, minimum line width line spacing 3/3mil, impedance ±10%, resin plug hole + plating hole filling, green oil, white characters

Product structure: 18-layer high-frequency mixed pressure HDI
Material: FR-4, TG170, halogen-free + Panasonic M7
Board thickness: 0.50MM
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
4: Quantities range from prototype to volume production.
100% E-Test

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

5: PCB, FPC process production capability

Our Quality processes include

1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

8. Quality Assurance:
   Our Quality processes include:
   1. IQC: Incoming Quality Control (Incoming Materials Inspection)
   2. First Article Inspection for every process
   3. IPQC: In Process Quality Control
   4. QC: 100% Test & Inspection
   5. QA: Quality Assurance based on QC inspection again
   6. Workmanship: IPC-A-610, ESD
   7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

    

   Certificates:
   ISO9001-2008
   ISO/TS16949
   UL
   IPC-A-600G and IPC-A-610E Class II compliance
   Customer's requirements

    

   Quick Detail:

   1. PCB Assembly on SMT and DIP

   2. PCB schematic drawing/ layout /producing

   3. PCBA clone/change board

   4. Components sourcing and purchasing for PCBA

   5. Enclosure design and plastic injection molding

   6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

   7. IC programming

   Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

   PCB, FPC product application field

   Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

   FAQ:

   Q: What files do you use in PCB fabrication?

   A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

   Q: Is it possible you could offer sample?

   A: Yes, we can custom you sample to test before mass production

   Q: When will I get the quotation after sent Gerber, BOM and test procedure?

   A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

   Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

   A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

   Q: How can I make sure the quality of my PCB?

   Tag:

   electronic assembly services,

   electronic pcb assembly

   PCB, FPC process production capability

   Technical ltem		MassProduct		Advanced Technology
   		2016		2017		2018
   Max.Layer Count		26L		36L		80L
   Through-hole plate		2～45L		2～60L		2～80L
   Max.PCBSize(in)		24*52"		25*62"		25*78.75"
   The layer number of FPC		1～36L		1～50L		1～60L
   Max.PCBSize(in)		9.8"*196"		9.8"*196"		10"*196"Reel to reel
   Layeredplatelayer		2～12L		2～18L		2～26L
   Max.PCBSize(in)		9"*48"		9"*52"		9"*62"
   Combination of hard and soft layers		3～26L		3～30L		3～50L
   Interconnect HDI		5+X+5Interconnect HDI		7+X+7Interconnect HDI		8+X+8,Interconnect HDI
   HDI PCB		4～45L		4～60L		4～80L
   Interconnect HDI		3+20+3		4+X+4Interconnect HDI		4+X+4,Interconnect HDI
   Max.PCBSize(in)		24"*43"		24"*49"		25"*52"
   Material		FR-4 Rogers		FR-4 Rogers		FR-4 Rogers
   Base material		Halogenfree,LowDK		Halogenfree,LowDK		Halogenfree,LowDK
   Build-up Material		FR-4		FR-4		FR-4
   BOard,Thickness(mm)	Min.12L(mm)	0.43		0.42～8.0mm		0.38～10.0mm
   	Min.16L(mm)	0.53		1.60～8.0mm		0.45～10.0mm
   	Min.18L(mm)	0.63		2.0～8.0		0.51～10.0mm
   	Min.52L(mm)	0.8		2.50～8.0mm		0.65～10.0mm
   	MAX(mm)	3.5		10.0mm		10.0mm
   Min.CoreThickness um(mil)		254"(10.0)		254"(10.0)		0.10～254(10.0mm)
   Min.Build up Dielectric		38(1.5)		32(1.3)		25(1.0)
   BaseCopperWeight	Inner Layer	4/1-8 OZ		4/1-15 OZ		4/1-0.30mm
   	Out Layer	4/1-10 OZ		4/1-15 OZ		4/1-30 OZ
   Gold thick		1～40u"		1～60u"		1～120u"
   Nithick		76～127u"		76～200u"		1～250u"
   Min.HOle/Land um(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
   Min.Laser via/landum(mil)		60/170(2.4/6.8)		50/150(2/6)		50/150(2/6)
   Min. IVH,Hole size/landum(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
   DieletricThickness		38(1.5)		32(1.3)		32(1.3)
   		125(5)		125(5)		125(5)
   SKipvia		Yes		Yes		Yes
   viaoNhie(laserviaon BuriedPTH)		Yes		Yes		Yes
   Laser Hole Filling		Yes		Yes		Yes
   Technicalltem				Mass Product		Advanced Technolgy
   				2017year		2018year	2019year
   Drill hole depth ratio		ThroughHole		2017year		.40:1	.40:1
   Aspet Ratio		Micro Via		.35:1		1.2:1	1.2:1
   Copper Filling Dimple Size um(Mil)				10(0.4)		10(0.4)	10(0.4)
   Min.LineWidth＆space		lnner Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
   		Plated Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
   BGAPitch mm(Mil)				0.3		0.3	0.3
   Min.PTH Hole ring um(mil)				75(3mil)		62.5(2.5mil)	62.5(2.5mil)
   Line Width Control		∠2.5MIL		±0.50		±0.50	±0.50
   		2.5Mil≤L/W∠4mil		±0.50		±0.50	±0.50
   		≦3mil		±0.60		±0.60	±0.60
   Laminated structure		Layer by layer		3+N+3		4+N+4	5+N+5
   		Sequential Build-up		20L Any Layer		36L Any Layer	52L Any Layer
   		Multi-layer overlay		N+N		N+N	N+N
   				N+X+N		N+X+N	N+X+N
   		sequential Lamination		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
   		Soft and hard bonding		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
   PTH filling process				PTH resin plug hole + plating fill Electroplated hole/copper plug hole		PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

    

   PCB, FPC main material supplier

   NO	supplier		Supply material name			Material origin
   1	Japan		High frequency materials, PI, covering membrane,Copper berth			Mitsubishi Japan
   2	dupont		High frequency materials, PI, covering film, dry film,Copper berth			Japan
   3	panasonic		High frequency materials, PI, covering membrane,Copper berth			Japan
   4	SanTie		PI, covering membrane			Japan
   5	Born good		FR-4,PI,PP,Copper berth			shenzhen, China
   6	A rainbow		PI, covering membrane,Copper berth			Taiwan
   7	teflon		High frequency materials			The United States
   8	Rogers		High frequency materials			The United States
   9	Nippon Steel		PI, covering membrane,Copper berth			Taiwan
   10	sanyo		PI, covering membrane,Copper berth			Japan
   11	South Asia		FR-4,PI,PP,Copper berth			Taiwan
   12	doosan		FR-4,PP			South Korea
   13	Tai Yao plate		FR-4,PP,Copper berth			Taiwan
   14	Alight		FR-4,PP,Copper berth			Taiwan
   15	Yaoguang		FR-4,PP,Copper berth			Taiwan
   16	Yalong		FR-4,PP			The United States
   17	ISOAL		FR-4,PP			Japan
   18	OAK		Buried, buried resistance, PP			Japan
   19	United States 3M		FR-4,PP			The United States
   20	Bergs		Copper and aluminum matrix			Japan
   21	The sun		ink			Taiwan
   22	Murata		ink			Japan
   23	generous andbenevolent		PI, covering membrane,Copper berth			China's jiangxi
   24	Yasen		PPI, covering membrane			China jiangsu
   25	Yong Sheng Tai		ink			China guangdong panyu
   26	mita		ink			Japan
   27	Transcript		ceramic material			Taiwan
   28	HOME		ceramic material			Japan
   29	Fe-Ni-Mn		Alloy Invar, Section Steel			Taiwan