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Fast Switching Mosfet Power Transistor AP6H06S 6A 60V Customized

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Shenzhen Hua Xuan Yang Electronics Co.,Ltd

Fast Switching Mosfet Power Transistor AP6H06S 6A 60V Customized

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Product Details

Fast Switching Mosfet Power Transistor AP6H06S 6A 60V Customized

 

Mosfet Power Transistor Introduction

 

MOSFET technology is ideal for use in many power applications, where the low switch on resistance enables high levels of efficiency to be attained.

There is a number of different varieties of power MOSFET available from different manufacturers, each with its own characteristics and abilities.

Many power MOSFETs incorporate a vertical structure topology. This enables high current switching with high efficiency within a relatively small die area. It also enables the device to support high current and voltage switching.

 

 

General Features


VDS = 60V ID =6 A
RDS(ON) < 35mΩ @ VGS=10V

 

Application

 

Battery protection
Load switch
Uninterruptible power supply

 

 

Package Marking and Ordering Information

 

Product IDPackMarkingQty(PCS)
AP6H06SSOP-8AP6H06S3000

 

Absolute Maximum Ratings (TA=25unless otherwise noted)

 

ParameterSymbolLimitUnit
Drain-Source VoltageVDS60V
Gate-Source VoltageVGS±20V
Drain Current-ContinuousID6A
Drain Current-Continuous(TC=100℃)ID (100℃)3.5A
Pulsed Drain CurrentIDM24A
Maximum Power DissipationPD2W
Operating Junction and Storage Temperature RangeTJ,TSTG-55 To 150
Thermal Resistance,Junction-to-Ambient (Note 2)RθJA62.5℃/W

 

Electrical Characteristics (TA=25unless otherwise noted)

 

 

ParameterSymbolConditionMinTypMaxUnit
Drain-Source Breakdown VoltageBVDSSVGS=0V ID=250μA60--V
Zero Gate Voltage Drain CurrentIDSSVDS=60V,VGS=0V--1μA
Gate-Body Leakage CurrentIGSSVGS=±20V,VDS=0V--±100nA
Gate Threshold VoltageVGS(th)VDS=VGS,ID=250μA1.21.62.5V

 

Drain-Source On-State Resistance

RDS(ON)VGS=10V, ID=5A-2635mΩ
RDS(ON)VGS=4.5V, ID=5A-3245mΩ
Forward TransconductancegFSVDS=5V,ID=5A11--S
Input CapacitanceClss -979-PF
Output CapacitanceCoss-120-PF
Reverse Transfer CapacitanceCrss-100-PF
Turn-on Delay Timetd(on) -5.2-nS
Turn-on Rise Time

r

t

-3-nS
Turn-Off Delay Timetd(off)-17-nS
Turn-Off Fall Time

f

t

-2.5-nS
Total Gate ChargeQg

 

VDS=30V,ID=5A,

-22 nC
Gate-Source ChargeQgs-3.3 nC
Gate-Drain ChargeQgd-5.2 nC
Diode Forward Voltage (Note 3)VSDVGS=0V,IS=5A- 1.2V
Diode Forward Current (Note 2)

S

I

 --5A
Forward Turn-On TimetonIntrinsic turn-on time is negligible (turn-on is dominated by LS+LD)

 

Notes:

 

1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec.

3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.

4. Guaranteed by design, not subject to production

5. EAS condition:Tj=25℃,VDD=30V,VG=10V,L=0.5mH,Rg=25 Ω

 

Attention

 

1,Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications.

2,APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein.

3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.

4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design.

5,In the event that any or all APM Microelectronics products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law.

6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD.

7, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. APM Microelectronics believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.

, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use.

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