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AP7H03DF 7A 30V DFN33 N Channel Mos Field Effect Transistor High Frequency

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Shenzhen Hua Xuan Yang Electronics Co.,Ltd

AP7H03DF 7A 30V DFN33 N Channel Mos Field Effect Transistor High Frequency

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Product Details

AP7H03DF 7A 30V DFN33 N Channel Mos Field Effect Transistor High Frequency

 

N Channel Mos Field Effect Transistor Description:

 

The AP7H03DF is the highest performance trench
N-ch MOSFETs with extreme high cell density,
which provide excellent RDSON and gate charge
for most of the small power switching and
load switch applications. The meet the RoHS and
Product requirement with full function reliability approved.

 

N Channel Mos Field Effect Transistor Features

 

VDS = 30V ID = 7A
RDS(ON) < 18mΩ @ VGS=4.5V
RDS(ON) < 30mΩ @ VGS=2.5V

 

Details

 

Mos Field Effect Transistor are used in many power supply and general power applications, especially as switches. Variant s include planar MOSFETs, VMOS, UMOS TrenchMOS, HEXFETs and other different brand names.


Package Marking and Ordering Information

 

 

Product IDPackMarkingQty(PCS)
AP7H03DFDFN3*3-8LAP7H03DF XXX YYYY5000

 

Absolute Maximum Ratings (TA=25unless otherwise noted)

 

 

SymbolParameterRatingUnits
V DSDrain-Source Voltage30V
V GSGate-Sou rce Voltage±20V
ID @TC=25 ℃Continuous Drain Current, V GS @ 10V 17A
ID @TC=100 ℃Continuous Drain Current, V GS @ 10V 15A
ID @TA=25 ℃Continuous Drain Current, V GS @ 10V 16.4A
ID @TA=70 ℃Continuous Drain Current, V GS @ 10V 16A
IDMPulsed Drain Current 256A
EASSingle Pulse Avalanche Energy 322.1mJ
IASAvalanche Current21A
P D@TC=25 ℃Total Power Dissipation 420.8W
P D@TA=25 ℃Total Power Dissipation 41.67W
TSTGStorage Temperature Range-55 to 150
TJOperating Junction Temperature Range-55 to 150
RθJAThermal Resistance Junction-ambient 175℃/W
RθJCThermal Resistance Junction-Case 16℃/W

 

Electrical Characteristics (TJ=25 , unless otherwise noted)

 

 

SymbolParameterConditionsMin.Typ.Max.Unit
BV DSSDrain-Source Breakdown VoltageV GS=0V , I D=250uA30------V
△BV DSS/ △TJBVDSS Temperature CoefficientReference to 25 ℃ , ID=1mA---0.022---V/℃

 

RDS(ON)

 

Static Drain-Source On-Resistance 2

V GS=10V , ID=10A------18

 

V GS=4.5V , ID=5A------30
V GS(th)Gate Threshold VoltageV GS=V DS , ID =250uA1.0---2.5V
△VGS(th)V GS(th) Temperature Coefficient ----5.1---mV/℃
IDSSDrain-Source Leakage CurrentV DS=24V , V GS=0V , TJ =25 ℃------1uA
V DS=24V , V GS=0V , TJ =55 ℃------5
IGSSGate-Source Leakage CurrentV GS = ±20V , V DS=0V------±100nA
gfsForward TransconductanceV DS=5V , ID=10A---4.5---S
RgGate ResistanceV DS=0V , V GS=0V , f=1MHz---2.5---Ω
QgTotal Gate Charge (4.5V) ---7.2--- 
QgsGate-Source Charge---1.4---
QgdGate-Drain Charge---2.2---
Td(on)Turn-On Delay Time

 

V DD=12V , V GS=10V ,

RG=3.3

ID=5A

---4.1---

 

ns

Tr    
Td(off)Turn-Off Delay Time---15.5---
TfFall Time---6.0---
CissInput Capacitance ---572--- 
CossOutput Capacitance---81---
CrssReverse Transfer Capacitance---65---
ISContinuous Source Current 1,5V G=V D=0V , Force Current------28A
ISMPulsed Source Current 2,5------56A
V SDDiode Forward Voltage 2V GS=0V , I S=1A , TJ =25 ℃------1.2V
SymbolParameterConditionsMin.Typ.Max.Unit
BV DSSDrain-Source Breakdown VoltageV GS=0V , I D=250uA30------V
△BV DSS/ △TJBVDSS Temperature CoefficientReference to 25 ℃ , ID=1mA---0.022---V/℃

 

RDS(ON)

 

Static Drain-Source On-Resistance 2

V GS=10V , ID=10A------18

 

V GS=4.5V , ID=5A------30
V GS(th)Gate Threshold VoltageV GS=V DS , ID =250uA1.0---2.5V
△VGS(th)V GS(th) Temperature Coefficient ----5.1---mV/℃
IDSSDrain-Source Leakage CurrentV DS=24V , V GS=0V , TJ =25 ℃------1uA
V DS=24V , V GS=0V , TJ =55 ℃------5
IGSSGate-Source Leakage CurrentV GS = ±20V , V DS=0V------±100nA
gfsForward TransconductanceV DS=5V , ID=10A---4.5---S
RgGate ResistanceV DS=0V , V GS=0V , f=1MHz---2.5---Ω
QgTotal Gate Charge (4.5V) ---7.2--- 
QgsGate-Source Charge---1.4---
QgdGate-Drain Charge---2.2---
Td(on)Turn-On Delay Time

 

V DD=12V , V GS=10V ,

RG=3.3

ID=5A

---4.1---

 

ns

Tr    
Td(off)Turn-Off Delay Time---15.5---
TfFall Time---6.0---
CissInput Capacitance ---572--- 
CossOutput Capacitance---81---
CrssReverse Transfer Capacitance---65---
ISContinuous Source Current 1,5V G=V D=0V , Force Current------28A
ISMPulsed Source Current 2,5------56A
V SDDiode Forward Voltage 2V GS=0V , I S=1A , TJ =25 ℃------1.2V

 

Note :

 

1.The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.

2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%

3.The EAS data shows Max. rating . The test condition is V DD =25V,VGS=10V,L=0.1mH,IAS=21A

4.The power dissipation is limited by 150℃ junction temperature

5.The data is theoretically the same as I D and I DM , in real applications , should be limited by total power dissipation.

 

Attention

 

1,Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications.

2,APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein.

1, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.

2, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design.

3,In the event that any or all APM Microelectronics products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law.

4, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD.

5, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. APM Microelectronics believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.

, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use

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