Active Member
|
[China]
Address: Room 906, Tower B, Wanda Plaza Office Building, No. 171 Zhongyuan Rd, Zhongyuan District, Zhengzhou,450000, Henan, China
Contact name:Mary Zhang
Please input your companyname! |
|
|
Our expapplicationertise encompasses a broad range of electronic materials including Mono Crystalline and Poly Crystalline Silicon, Sapphire ,Quartz, Specialty glasses, and a variety of other hard compounds and ceramics. Whether your concern is part quality or productivity, “MORESUPERHARD ” dicing blades step up to the challenge.
Our standard and custom specifications are available in a variety of bond, hardness and diamond or cubic boron nitride(CBN) Grain sizes to meet your material removal, Heometry , chipping, and surface finish requirements. We also offer the broadest range of blade sizes and bond systems including sintered and plated metal as well as resin for maximum engineering flexibility.
Specification of diamond cutting discs (including resin bond , electroplated bond and metal bond ):
| Product Name | Resin/Electroplated/Metal bond dicing blade |
| OD | 50-125mm |
| ID | 25.4/40/88.9 |
| Grit | 200#-5000# (D107-D1) |
| Thickness | 0.10-2.00mm (Based on diamond grit size) |
According to customers’ requirement | |
Metal bond dicing blade
Introduction of Metal bond dicing blade:
Metal bond blades, the sintered diamond blades with the addition of
metal powder in bond, have high retaining force for grain.
With the higher wear-resistance and advanced cutting capability and
higher stiffness, the metal bond blades can effectively reduce
cutting defects like slanted-kerf.
Features of Metal bond dicing blade:
Ultra thin blade (over 45um)
A wide selection of bonds available for various semiconductor packages.
Applications of Metal bond dicing blade:
Sapphire,Optical Glass,CSP
