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[China]
Address: Room 906, Tower B, Wanda Plaza Office Building, No. 171 Zhongyuan Rd, Zhongyuan District, Zhengzhou,450000, Henan, China
Contact name:Mary Zhang
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Our expapplicationertise encompasses a broad range of electronic materials including Mono Crystalline and Poly Crystalline Silicon, Sapphire ,Quartz, Specialty glasses, and a variety of other hard compounds and ceramics. Whether your concern is part quality or productivity, “MORESUPERHARD ” dicing blades step up to the challenge.
Our standard and custom specifications are available in a variety of bond, hardness and diamond or cubic boron nitride(CBN) Grain sizes to meet your material removal, Heometry , chipping, and surface finish requirements. We also offer the broadest range of blade sizes and bond systems including sintered and plated metal as well as resin for maximum engineering flexibility.
Specification of diamond cutting discs :
| Product Name | Resin/Electroplated/Metal bond dicing blade |
| OD | 50-125mm |
| ID | 25.4/40/88.9 |
| Grit | 200#-5000# (D107-D1) |
| Thickness | 0.10-2.00mm (Based on diamond grit size) |
According to customers’ requirement Sales@moresuperhard.com | |
Resin diamond dicing blade
Introduction of Resin bond dicing blade:
Resin bond blades with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.
Features of Resin bond dicing blade:
Improve the cutting quality and efficiency on hard and brittle materials.
A wide selection of bonds available for high-grade processing on hard and brittle materials.
Ultra thin blade (over 50um)
Applications of Resin bond dicing blade:
Hard and Brittle Materials, Ceramics, Optical Glass, Glass for Optical Fiber Communication, Splitter, IR Filter, QFN
