Results foriso9001 skived heat sinkfrom 15342 Products.
|
|
Product Description: Product Overview: CNC Processing Service Aluminum Skived Fin Heat Sink For Customized Product Dimension The Skived Fin Heat Sink, also known as Fin Type Heat ...
|
|
|
|
|
Fodor factory offer aluminum cold forged heat sink with ISO9001:2015 Quick Detail Raw Material AL1070 Custom Service Yes, OEM/ODM Service Quality System ISO9001:2015 Processing ...
|
|
|
|
|
LED Heat Sink High Adhesive Tape , Thermal Adhesive Aluminum Foil Tape RoHs The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and ...
|
|
|
|
|
Customized Skiving Copper Pipe Heat Sink For Computer Mainboard Specification: Application Computer mainboard Surface finish mill/anodizing/powder coating/sand blasting/plating ...
|
|
|
|
|
TEC Heat Sink Thermoelectric Cooler Module , Teg Peltier Module Thermoelectric Benefits • TE coolers contain no chlorofluorocarbons or other materials which may require periodic ...
|
|
|
|
|
Product Description: CNC Copper Pipe Heat Sink High Thermal Conductivity for Temperature Control Skived Fin Heat Sink is a high-performance heat dissipation solution designed for ...
|
|
|
|
|
Fodor factory offer aluminum standard existing mold heat sink with ISO9001:2015 Quick Detail Raw Material AL1070 Custom Service Yes, OEM/ODM Service Quality System ISO9001:2015 ...
|
|
|
|
|
LED Heat Sink Aluminum Foil Adhesive Tape with High Thermal Conductivity 1.6 W /mK The TIA™800AL Series products are mostly used for bonding heat dissipation fins, microprocessors ...
|
|
|
|
|
Glass Fiber Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA™808FG Series products are mostly used for bonding heat dissipation fins, ...
|
|
|
|
|
Heat Sink Thermal Conductive Acrylic Based Adhesive High Bond Strength 10" x 18" Size The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocesso...
|
|
|
|
|
Black 5.0W / mk TCP100-50-01A Nylon Heat Sinking 150℃ Thermal Conductive Engineer Plastic 2.5～3.5kJ/m2 for LED light TCP™100-50-01A is a Thermally Conductive Engineering Plastic ...
|
|
|
|
|
The TIA™810FG Acrylic Thermally Adhesive Tape For LED Mount Heat Sink Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, ...
|
|
|
|
|
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, ...
|
|
|
|
|
White 130℃ PP Heat Sinking Thermal Conductive Plastic TCP 100-01PP , 1 W-mK , RoHs and UL 1.55g/cm3, 94V0 TCP 100-01PP is a Thermally Conductive Engineering Plastic developed for ...
|
|
|
|
|
Dielectric Constant 5.0 MHz Conductive Pads Easy Release Construction for LED Controller The TIF1160-30-06UF use a special process, with silicone as the base material, adding ...
|
|
|
|
|
IGBTs Phase Change Material Heat Sink 0.024℃-in² / W With Low Thermal Resistance Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, ...
|
|
|
|
|
LED Heat Sinking Housing Thermal Conductive Pad 4.7 W / mK for Uneven Surfaces Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many ...
|
|
|
|
|
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™800A Series begins ...
|
|
|
|
|
4W/MK Heat Sink Pad Sheet For LED Ceilinglight Pink TIF100-40-14E , 35 Shore 00 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite ...
|
|
|
|
|
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™808A Series begins ...
|
|
|
You may also be interested in :
