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8 Layer Multilayer HDI PCB With Blind Vias printed circuit boards Prototype
General information:
Layer:8
Material:FR4
Thickness: 2.0MM
Surface finish: ENIG
Special: Blind hole,L1-L2,L3-L4,L5-L6,vias filled and capped
Board size:2*6CM
Solder mask:No
Silk screen: White
Name: Multilayer 8Layer Blind Vias PCB Boards
Delivery time: 10days for sample and small&medium batch
About quote:For the special of blind vias pcb,so the accurate quotation have to provide the gerber file(DXP etc.)
Package Details: inner packing:vacuum packing/plastic bag outer packing:standard carton packing
Blind vias:
Blind vias are used to connect one outer layer with at least
one inner layer.
The holes for each connection level must be defined as a
separate drill file.
The ratio of hole depth to drill diameter (aspect ratio) must be ≤
1.
The smallest hole determines the depth and thus the max. distance
between the
outer layer and the corresponding inner layers.
For detail blind&buried vias pcb
Key words: Microvia, Via-in-Pad
HDI Blind vias PCB:
HDI boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
Special technologies used with HDI any-layer printed circuit boards:
Edge plating for shielding and ground connection
Minimum track width and spacing in mass production around 40μm
Stacked microvias (plated copper or filled with conductive paste)
Cavities, countersunk holes or depth milling
Solder resist in black, blue, green, etc.
Low-halogen material in standard and high Tg range
Low-DK Material for Mobile Devices
All recognised printed circuit board industry surfaces available
Multilayer PCB production
The production of multilayer PCBs involves several steps, from design and fabrication to assembly and testing. Here is an overview of the typical production process:
1,Design: The design process involves creating the schematic and layout of the PCB using specialized PCB design software. The design includes defining the layer stack-up, trace routing, component placement, and signal integrity considerations. Design rules and constraints are set to ensure manufacturability and reliability.
2,CAM (Computer-Aided Manufacturing) Processing: Once the PCB design is complete, it undergoes CAM processing. CAM software converts the design data into manufacturing instructions, including generating Gerber files, drill files, and layer-specific information required for fabrication.
3,Material Preparation: The PCB fabrication process begins with material preparation. The core material, typically FR-4 fiberglass epoxy, is cut into appropriate panel sizes. Copper foil sheets are also prepared in the required thicknesses for the inner and outer layers.
4,Inner Layer Processing: The inner layer processing involves a series of steps:
a. Cleaning: The copper foil is cleaned to remove any contaminants.
b. Lamination: The copper foil is laminated to the core material using heat and pressure, creating a panel with copper-clad surfaces.
c. Imaging: A photosensitive layer called the photoresist is applied to the panel. The inner layer artwork from the Gerber files is used to expose the photoresist layer, defining the copper traces and pads.
d. Etching: The panel is etched to remove the unwanted copper, leaving behind the desired copper traces and pads.
e. Drilling: Precision holes are drilled in the panel to create vias and component mounting holes.
5,Outer Layer Processing: The outer layer processing involves similar steps as the inner layer, including cleaning, lamination, imaging, etching, and drilling. However, the outer layer processing also includes the application of soldermask and silkscreen layers on the surface for protection and component identification.
6,Multilayer Lamination: Once the inner and outer layers are processed, they are stacked together with layers of prepreg material. The stack is then placed in a hydraulic press and subjected to heat and pressure to bond the layers together, forming a solid multilayer structure.
7,Plating and Surface Finish: The plated-through holes (vias) are electroplated with copper to ensure electrical connectivity between the layers. The exposed copper surfaces are then treated with a surface finish, such as tin, lead-free solder, or gold, to protect them from oxidation and facilitate soldering during assembly.
8,Routing and V-Cut: After the multilayer lamination, the PCB panel is routed to separate individual PCBs. V-cut or scoring techniques may also be used to create perforation lines, allowing easy separation of PCBs after assembly.
9,Assembly: The assembled components and soldering take place on the multilayer PCB. This involves the placement of electronic components onto the PCB, soldering them to the copper pads, and any necessary reflow or wave soldering processes.
10,Testing and Inspection: Once the assembly is complete, the PCBs undergo various testing and inspection procedures to ensure functionality, electrical continuity, and quality. This includes automated optical inspection (AOI), functional testing, and other tests as per the specific requirements.
Packaging and Shipping: The final step involves packaging the PCBs to protect them during transportation and shipping them to the desired destination.
Multilayer pcb stack up
The stack-up of a multilayer PCB refers to the arrangement and order of the layers in the PCB construction. The stack-up is a critical aspect of PCB design as it determines the electrical performance, signal integrity, impedance control, and thermal characteristics of the board. The specific stack-up configuration depends on the requirements of the application and the design constraints. Here is a general description of a typical multilayer PCB stack-up:
1,Signal Layers: The signal layers, also known as the routing layers, are where the copper traces that carry electrical signals are located. The number of signal layers depends on the complexity of the circuit and the desired density of the PCB. The signal layers are typically sandwiched between the power and ground planes for better signal integrity and noise reduction.
2,Power and Ground Planes: These layers provide a stable reference for the signals and help distribute power and ground throughout the PCB. The power planes carry the supply voltages, while the ground planes serve as return paths for the signals. Placing power and ground planes adjacent to each other reduces the loop area and minimizes electromagnetic interference (EMI) and noise.
3,Prepreg Layers: Prepreg layers consist of insulating material impregnated with resin. They provide insulation between adjacent signal layers and help bond the layers together. Prepreg layers are typically made of fiberglass-reinforced epoxy resin (FR-4) or other specialized materials.
4,Core Layer: The core layer is the central layer of the PCB stack-up and is made of a solid insulating material, often FR-4. It provides mechanical strength and stability to the PCB. The core layer may also include additional power and ground planes.
5,Surface Layers: The surface layers are the outermost layers of the PCB, and they can be signal layers, power/ground planes, or a combination of both. The surface layers provide connectivity to external components, connectors, and soldering pads.
6,Soldermask and Silkscreen Layers: The soldermask layer is applied over the surface layers to protect the copper traces from oxidation and prevent solder bridges during the soldering process. The silkscreen layer is used for component markings, reference designators, and other text or graphics to assist in PCB assembly and identification.
The exact number and arrangement of layers in a multilayer PCB stack-up vary depending on the design requirements. More complex designs may have additional power planes, ground planes, and signal layers. Additionally, controlled impedance traces and differential pairs may require specific layer arrangements to achieve desired electrical characteristics.
It's important to note that the stack-up configuration should be carefully designed, taking into consideration factors such as signal integrity, power distribution, thermal management, and manufacturability, to ensure the overall performance and reliability of the multilayer PCB.
There are several kinds of multilayer PCBs that are used in different applications. Here are some common types:
Standard Multilayer PCB: This is the most basic type of multilayer PCB, typically consisting of four to eight layers. It is widely used in general electronic devices and applications where moderate complexity and density are required.
High-Density Interconnect (HDI) PCB: HDI PCBs are designed to provide higher component density and finer traces than standard multilayer PCBs. They often have microvias, which are very small diameter vias that allow for more interconnections in a smaller space. HDI PCBs are commonly used in smartphones, tablets, and other compact electronic devices.
Flex and Rigid-Flex PCB: These types of multilayer PCBs combine flexible and rigid sections into a single board. Flex PCBs use flexible materials like polyimide, while rigid-flex PCBs incorporate both flexible and rigid sections. They are used in applications where the PCB needs to bend or conform to a specific shape, such as in wearable devices, medical equipment, and aerospace systems.
Sequential Lamination PCB: In sequential lamination PCBs, the layers are laminated together in separate groups, allowing for a higher number of layers. This technique is used when a large number of layers, such as 10 or more, are required for complex designs.
Metal Core PCB: Metal Core PCBs have a layer of metal, usually aluminum or copper, as the core layer. The metal core provides better heat dissipation, making them suitable for applications that generate a significant amount of heat, such as high-power LED lighting, automotive lighting, and power electronics.
RF/Microwave PCB: RF (Radio Frequency) and microwave PCBs are designed specifically for high-frequency applications. They use specialized materials and manufacturing techniques to minimize signal loss, impedance mismatch, and electromagnetic interference. RF/Microwave PCBs are commonly used in wireless communication systems, radar systems, and satellite communications.
Multilayer pcb application:
Multilayer PCBs find application across various industries and electronic devices where complex circuitry, high density, and reliability are required. Some common applications of multilayer PCBs include:
Consumer Electronics: Multilayer PCBs are extensively used in consumer electronic devices such as smartphones, tablets, laptops, gaming consoles, televisions, and audio systems. These devices require compact designs and high-density interconnections to accommodate numerous components.
Telecommunications: Multilayer PCBs play a crucial role in telecommunications equipment, including routers, switches, modems, base stations, and network infrastructure. They enable efficient signal routing and facilitate the high-speed data transmission required in modern communication systems.
Automotive Electronics: Modern vehicles incorporate a wide range of electronics for functions like engine control, infotainment systems, advanced driver-assistance systems (ADAS), and telematics. Multilayer PCBs are used to accommodate the complex circuitry and ensure reliable performance in automotive environments.
Industrial Equipment: Multilayer PCBs are utilized in industrial equipment such as control systems, robotics, automation systems, and manufacturing machinery. These PCBs provide the necessary interconnections for precise control and monitoring of industrial processes.
Aerospace and Defense: The aerospace and defense industries rely on multilayer PCBs for avionics systems, radar systems, communication equipment, guidance systems, and satellite technology. These applications demand high reliability, signal integrity, and resistance to harsh environments.
Medical Devices: Medical devices and equipment, including diagnostic tools, imaging systems, patient monitoring devices, and surgical instruments, often utilize multilayer PCBs. These PCBs enable the integration of complex electronics and assist in accurate and reliable medical diagnostics and treatments.
Power Electronics: Multilayer PCBs are employed in power electronics applications, such as inverters, converters, motor drives, and power supplies. They help manage high currents, heat dissipation, and efficient power distribution.
Industrial Control Systems: Multilayer PCBs are utilized in industrial control systems for process control, factory automation, and robotics. These systems require reliable and high-performance PCBs to ensure precise control and monitoring of industrial processes.
