Customized 4 Layer Circuit Board Mini Pad Multi Layer PCB Maker

4 Layer Customized Mini Pad Multi Layer Circuit Board PCB Maker

Basic technology:

Name:Multilayer printed circuit boards

Layer:4

Material:FR4

Thickness:1.0mm

Copper weight:2OZ

Surface finish:ENIG

Board size:15*8CM

Panel:2*1

Solder mask:Green

Silk screen: White

Multilayer PCB Maker in China:

Do you manufacture advanced electronics and require multilayer circuit boards? Do you need your PCBs in hand as fast as possible? For the best multilayer printed circuit boards and the fastest turn, trust Oneseine Technology. How fast? Same-day turn is available on two-layer PCBs, and 24-hour turn is available on multilayer circuit boards.

Despite our incredibly quick turnaround, we cut zero corners and take zero shortcuts while fabricating multilayer PCBs. In fact, multilayer PCB fabrication requires an even higher level of attention to detail than your average printed circuit board. Care must be taken to ensure all layers are correctly registered despite deformations and stresses produced by the heat and pressure of the multilayer PCB fabrication process. Our highly trained PCB assembly technicians utilize state-of-the-art multilayer circuit board fabrication equipment to ensure that the finished boards we send out meet your exacting standards and technical specifications.

Multi-layer circuit board

Multi-layer circuit board according to the number of wiring surface to determine the process difficulty and processing prices, ordinary sub-single-sided circuit board alignment and double-sided alignment, commonly known as single-sided and double-sided, but high-end electronic products, product space design constraints , In addition to surface wiring, the internal multi-layer lines can be superimposed, the production process, the production of each layer line, and then through the optical device positioning, pressure together, so that multi-layer circuit stack in a circuit board. Commonly known as multi-layer circuit boards. Any greater than or equal to 2 layers of the circuit board, can be called multi-layer circuit board. Multi-layer circuit boards can be divided into multi-layer rigid circuit boards, multi-layer soft and hard circuit boards, multi-layer soft and hard combination of circuit boards.

A multi-substrate is fabricated by stacking two or more circuits with each other, with reliable pre-set interconnections therebetween. Since drilling and electroplating were done before all the layers were rolled together, this technique violated the traditional manufacturing process from the start. The innermost two layers are made of a traditional double-sided board, while the outer layer is different, and they are made of independent single-sided boards. Prior to rolling, the inner substrate will be drilled, plated, patterned, developed, and etched. The outer layer to be drilled is a signal layer which is plated in such a way as to form an equalized copper ring at the inner edge of the through-hole. The respective layers are then rolled together to form a multi-substrate, which can be interconnected using wave soldering (inter-component).

Multilayer PCB production

The production of multilayer PCBs involves several steps, from design and fabrication to assembly and testing. Here is an overview of the typical production process:

1,Design: The design process involves creating the schematic and layout of the PCB using specialized PCB design software. The design includes defining the layer stack-up, trace routing, component placement, and signal integrity considerations. Design rules and constraints are set to ensure manufacturability and reliability.

2,CAM (Computer-Aided Manufacturing) Processing: Once the PCB design is complete, it undergoes CAM processing. CAM software converts the design data into manufacturing instructions, including generating Gerber files, drill files, and layer-specific information required for fabrication.

3,Material Preparation: The PCB fabrication process begins with material preparation. The core material, typically FR-4 fiberglass epoxy, is cut into appropriate panel sizes. Copper foil sheets are also prepared in the required thicknesses for the inner and outer layers.

4,Inner Layer Processing: The inner layer processing involves a series of steps:

a. Cleaning: The copper foil is cleaned to remove any contaminants.

b. Lamination: The copper foil is laminated to the core material using heat and pressure, creating a panel with copper-clad surfaces.

c. Imaging: A photosensitive layer called the photoresist is applied to the panel. The inner layer artwork from the Gerber files is used to expose the photoresist layer, defining the copper traces and pads.

d. Etching: The panel is etched to remove the unwanted copper, leaving behind the desired copper traces and pads.

e. Drilling: Precision holes are drilled in the panel to create vias and component mounting holes.

5,Outer Layer Processing: The outer layer processing involves similar steps as the inner layer, including cleaning, lamination, imaging, etching, and drilling. However, the outer layer processing also includes the application of soldermask and silkscreen layers on the surface for protection and component identification.

6,Multilayer Lamination: Once the inner and outer layers are processed, they are stacked together with layers of prepreg material. The stack is then placed in a hydraulic press and subjected to heat and pressure to bond the layers together, forming a solid multilayer structure.

7,Plating and Surface Finish: The plated-through holes (vias) are electroplated with copper to ensure electrical connectivity between the layers. The exposed copper surfaces are then treated with a surface finish, such as tin, lead-free solder, or gold, to protect them from oxidation and facilitate soldering during assembly.

8,Routing and V-Cut: After the multilayer lamination, the PCB panel is routed to separate individual PCBs. V-cut or scoring techniques may also be used to create perforation lines, allowing easy separation of PCBs after assembly.

9,Assembly: The assembled components and soldering take place on the multilayer PCB. This involves the placement of electronic components onto the PCB, soldering them to the copper pads, and any necessary reflow or wave soldering processes.

10,Testing and Inspection: Once the assembly is complete, the PCBs undergo various testing and inspection procedures to ensure functionality, electrical continuity, and quality. This includes automated optical inspection (AOI), functional testing, and other tests as per the specific requirements.

Packaging and Shipping: The final step involves packaging the PCBs to protect them during transportation and shipping them to the desired destination.

Multilayer pcb stack up

The stack-up of a multilayer PCB refers to the arrangement and order of the layers in the PCB construction. The stack-up is a critical aspect of PCB design as it determines the electrical performance, signal integrity, impedance control, and thermal characteristics of the board. The specific stack-up configuration depends on the requirements of the application and the design constraints. Here is a general description of a typical multilayer PCB stack-up:

1,Signal Layers: The signal layers, also known as the routing layers, are where the copper traces that carry electrical signals are located. The number of signal layers depends on the complexity of the circuit and the desired density of the PCB. The signal layers are typically sandwiched between the power and ground planes for better signal integrity and noise reduction.

2,Power and Ground Planes: These layers provide a stable reference for the signals and help distribute power and ground throughout the PCB. The power planes carry the supply voltages, while the ground planes serve as return paths for the signals. Placing power and ground planes adjacent to each other reduces the loop area and minimizes electromagnetic interference (EMI) and noise.

3,Prepreg Layers: Prepreg layers consist of insulating material impregnated with resin. They provide insulation between adjacent signal layers and help bond the layers together. Prepreg layers are typically made of fiberglass-reinforced epoxy resin (FR-4) or other specialized materials.

4,Core Layer: The core layer is the central layer of the PCB stack-up and is made of a solid insulating material, often FR-4. It provides mechanical strength and stability to the PCB. The core layer may also include additional power and ground planes.

5,Surface Layers: The surface layers are the outermost layers of the PCB, and they can be signal layers, power/ground planes, or a combination of both. The surface layers provide connectivity to external components, connectors, and soldering pads.

6,Soldermask and Silkscreen Layers: The soldermask layer is applied over the surface layers to protect the copper traces from oxidation and prevent solder bridges during the soldering process. The silkscreen layer is used for component markings, reference designators, and other text or graphics to assist in PCB assembly and identification.

The exact number and arrangement of layers in a multilayer PCB stack-up vary depending on the design requirements. More complex designs may have additional power planes, ground planes, and signal layers. Additionally, controlled impedance traces and differential pairs may require specific layer arrangements to achieve desired electrical characteristics.

It's important to note that the stack-up configuration should be carefully designed, taking into consideration factors such as signal integrity, power distribution, thermal management, and manufacturability, to ensure the overall performance and reliability of the multilayer PCB.