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Rogers 4350B DK 3.48 DF 0.0031 0.1-1.5mm HIGH FREQUENCY PCB Boards
Specification:
Base material | Rogers 4350 | Board THK | 0.8mm |
Layer | 2 | Board size | 18*6cm |
Surface finish | Immersion gold | Line space | 6mil |
Copper THK | 1OZ | Line width | 6mil |
Parameter:
Product name: High frequency rogers 4350B PCB board Prototype
Multi-layer rogers 4350B Fabrication type:rogers4350+rogers4350,rogers4350+fr4
Layer No. | 1-28 |
Material | Rogers 4350/4003/5880/3003/3006/6010/3010 Etc. |
Board thickness | 0.1-2.0MM |
Standard material size | 12*18 inch 18*24inch 48*36inch |
Board thickness tolerance T≥0.8mm±8%,T＜0.8mm±5% | |
Wall hole copper thickness | ＞0.025mm(1mil) |
Finished hole | 0.15mm-6.3mm |
Min line width | 4mil/4mil(0.1/0.1mm) |
Min bonding pad space | 0.1mm(4mil) |
PTH aperture tolerance | ±0.075mm(3mil) |
NPTH aperture tolerance | ±0.05mm(2mil) |
Hole site deviation | ±0.05mm(2mil) |
Profile tolerance | ±0.10mm(4mil) |
Board bend&warp | ≤0.7% |
Insulation resistance | ＞1012Ωnormal |
Through-hole resistance | ＜300Ωnormal |
Electric strength | ＞1.3kv/mm |
Current breakdown | 10A |
Peel strength | 1.4N/mm |
Soldmask regidity | ＞6H |
Thermal stress | 288℃20Sec |
Testing voltage | 50-300v |
Min buried blind via | 0.2mm(8mil) |
Outer cooper thickness | 1oz-5oz |
Inner cooper thickness | 1/2 oz-4oz |
Aspect ratio | 8:1 |
SMT min green oil width | 0.08mm |
Min green oil open window | 0.05mm |
Insulation layer thickness | 0.075mm-5mm |
Aperture | 0.2mm-0.6mm |
Special technology | Inpedance,blind buried via,thick gold,aluminumPCB |
Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating |
RT/duriod
Rogers RT/duroid® high-frequency circuit materials are filled PTFE
(irregular glass or ceramic) composite coversfor use in high
reliability, aviation and defense applications. The RT/duroid types
have a long industry nearness of providing high-reliability
materials with predominant performance. This kind of material has
several benefits:
1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.
RO3000
RO3000 laminates are ceramic filled PTFE composites intended for
use in the commercial microwave and RF applications. R03000 series
laminates are circuit materials with very consistent mechanical
properties regardless of the dielectric constant selected. Due to
this characteristic, when designing multi-layer boards with varying
dielectric constants, there will be very little issues if any at
all The dielectric constant VS temperature of RO3000 series
materials is very stable. RO3000 laminates also are available in a
wide range of dielectric constants (3.0 to 10.2). The most common
applications are:
1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.
RO4000
RO4000 laminates and pre-pregs possess favorable properties that
are highly useful in microwave circuits and instances where
controlled impedance is needed. This series of laminates are very
price optimized and are also fabricated using standard FR4
processes which makes it suitable for multi-layer PCBs.
Additionally, it can be processed lead-free. The series of RO4000
laminates offer a range of dielectric constants (2.55-6.15) and are
available with UL 94 V-0 flame retardant versions. The most popular
applications of this are:
1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.
TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant
uniformity, low thermal coefficient of dielectric constant (Dk),
and a copper matched coefficient of thermal expansion. Because of
their electrical and mechanical stability, TMM high-frequency
laminates are perfect for high-reliability strip-line and
micro-strip applications. This kind of material has several
benefits:
1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into
account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of
standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes,
Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that
shows the characteristics of various types of PCB materials.
