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Fr4 Material Thickness Industrial Control System Turnkey PCB Board
PCB Quick detail:
Layer: 4 layers
Finished thickness: 2.6mm
Min outer layer line width / distance: 0.1mm/0.11mm
Min inner layer line width / distance: 0.12mm/0.15mm
Min aperture: 0.25mm
Minimum BGA solder joint: 0.23mm
Impedance requirements: 50 ohm, Tolerance + / -10%
Surface finished: Immersion Gold
Industrial Control PCB:
Are you looking for design help with your Industrial Control PCB or printed circuit board project? Oneseine has emerged as a leading PCBA manufacturer of time-critical, high performance Industrial Control PCB, Industrial Control PCB Board, printed circuit board solutions.
Industrial Control PCB Board Specifications
High quality Industrial Control Board
-PCB & PCBA Service
-UL,SGS,Rohs Certificated
-Competitive Price,High Quality
Our Capabilities of Industrial Control PCB Manufacturing
Total Pad Size | Standard | Advanced |
Capture Pad | Drill + 0.008 | Drill + 0.006 |
Landing Pad | Drill + 0.008 | Drill + 0.006 |
BC Mechanical Drill (Type III) | 0.008 | 0.006 |
Laser Drill Size | 0.004-0.010 | 0.0025 |
Material Thickness | 0.0035 | 0.0025 |
Stacked Via | Yes | Yes |
Type I Capabilities single & Double Deep | Yes | Yes |
Type II Capabilities Buried Vias with Microvias | Yes | Yes |
Type III Capabilities | Yes | Yes |
Copper Filled Microvia | Yes | Yes |
Smallest Copper Filled Microvia | 0.004 | 0.0025 |
Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:1 |
Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:1 |
FR4 Material Types
FR-4 has many different variations depending on the thickness of the material and chemical properties, such as the standard FR-4 and G10. The following list shows some common designations for FR4 PCB materials.
Standard FR4: This is the most common type of FR4. It provides good mechanical and moisture resistance, with heat resistance of about 140℃ to 150℃.
FR4 With High Tg: FR4 with high Tg is suitable for applications requiring high thermal cycling and temperatures greater than 150℃. Standard FR4 is limited to around 150℃, while FR4 with high Tg can withstand much higher temperatures.
FR4 With High CTI: FR4 with high CTI (Chemical Thermal Interaction) has better thermal conductivity than regular FR4 material. It has a comparative tracking index higher than 600 Volts.
FR4 without copper laminate: FR4 without copper laminate is a non-conductive material with excellent mechanical strength. It is mainly suitable for insulating boards and board supports.
FR4 G10: FR-4 G10 is a solid core material with excellent mechanical properties, high thermal shock resistance, excellent dielectric properties, and good electrical insulation properties.
The requirements of high frequency pcb material:
(1) the dielectric constant (Dk) must be very stable
(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.
(3) and copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.
(4) low water absorption, high water absorption will be affected in the damp when the dielectric constant and dielectric loss.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
What Is FR4 PCB Material?
FR-4 is a high-strength, high-resistant, glass-reinforced epoxy laminate material used to fabricate printed circuit boards (PCBs). The National Electrical Manufacturers Association (NEMA) defines it as a standard for glass-reinforced epoxy laminates.
The FR stands for flame retardant, and the number 4 differentiates this type of laminate from other similar materials. This particular laminate has woven glass-reinforced epoxy resin.
FR-4 PCB refers to the board manufactured with adjacent laminate material. This material is incorporated in double-sided, single-sided, and multi-layered boards.
ONESEINE'S STANDARD FR-4 MATERIAL PROPERTIES
High Glass Transition Temperature (Tg) (150Tg or 170Tg)
High Decomposition Temperature (Td) (> 345º C)
Low Coefficient of Thermal Expansion (CTE) ((2.5%-3.8%)
Dielectric Constant (@1 GHz): 4.25-4.55
Dissipation Factor (@ 1 GHz): 0.016
UL rated (94V-0, CTI = 3 minimum)
Compatible with standard and lead-free assembly.
Laminate thickness available from 0.005” to 0.125”
Pre-preg thicknesses available (approximate after lamination):
(1080 glass style) 0.0022”
(2116 glass style) 0.0042”
(7628 glass style) 0.0075”
FR4 PCB Applications:
FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The copper thickness or copper weight can vary and so is specified separately.
FR-4 is also used in the construction of relays, switches, standoffs, busbars, washers, arc shields, transformers and screw terminal strips.
