ITEQ IT158 Material Car Body Sensor FR4 PCB Automobile Sensor Circuit Board

ITEQ IT158 Material Car Body Sensor FR4 PCB Automobile Sensor Circuit Board

PCB parameter:

PCB name: Car sensor PCB

Layer:4

PCB Thickness:0.8+/-0.1mm

Size:135.84mm*117.83mm

PCB Material:ITEQ(IT158)

Min hole:0.2mm

Surface finish:immersion gold

Min line/width:0.116mm/0.1mm

Final product:Automobile sensor

Vehicle sensor PCB board introduction:

The vehicle sensor is an input device of the automobile computer system. It converts various working condition information such as vehicle speed, temperature of various media, engine operating conditions, etc. into electrical signals and transmits them to the computer, so that the engine is in the best condition. Working status. There are many sensors for vehicles. When judging the fault of the sensor, you should not only consider the sensor itself, but should consider the entire circuit in which the fault occurs. Therefore, in the search for faults, in addition to checking the sensor, check the wiring harness, the connector and the relevant circuit between the sensor and the electronic control unit.

Sensor characteristics

A sensor is a device or device that can sense a specified physical quantity and convert it into an available input signal according to a certain rule. Simply put, the sensor converts non-electricity into electricity.

Quantity of devices.

The sensor usually consists of three parts: a sensitive component, a conversion component, and a measurement circuit.

1) A sensitive component is a component that can directly sense (or respond to) the measured component, ie, the sensitive component that is measured through the sensor is converted into a non-electrical quantity or other quantity that has a certain relationship with the measured.

2) The conversion component converts the above non-electric quantity into an electrical parameter.

3) The function of the measuring circuit is to convert the electrical parameters input by the converting component into measurable electric quantities such as voltage, current or frequency for display, recording, control and processing.

FR4 Material Types

FR-4 has many different variations depending on the thickness of the material and chemical properties, such as the standard FR-4 and G10. The following list shows some common designations for FR4 PCB materials.

Standard FR4: This is the most common type of FR4. It provides good mechanical and moisture resistance, with heat resistance of about 140℃ to 150℃.

FR4 With High Tg: FR4 with high Tg is suitable for applications requiring high thermal cycling and temperatures greater than 150℃. Standard FR4 is limited to around 150℃, while FR4 with high Tg can withstand much higher temperatures.

FR4 With High CTI: FR4 with high CTI (Chemical Thermal Interaction) has better thermal conductivity than regular FR4 material. It has a comparative tracking index higher than 600 Volts.

FR4 without copper laminate: FR4 without copper laminate is a non-conductive material with excellent mechanical strength. It is mainly suitable for insulating boards and board supports.

FR4 G10: FR-4 G10 is a solid core material with excellent mechanical properties, high thermal shock resistance, excellent dielectric properties, and good electrical insulation properties.

What Is FR4 PCB Material?

FR-4 is a high-strength, high-resistant, glass-reinforced epoxy laminate material used to fabricate printed circuit boards (PCBs). The National Electrical Manufacturers Association (NEMA) defines it as a standard for glass-reinforced epoxy laminates.

The FR stands for flame retardant, and the number 4 differentiates this type of laminate from other similar materials. This particular laminate has woven glass-reinforced epoxy resin.

FR-4 PCB refers to the board manufactured with adjacent laminate material. This material is incorporated in double-sided, single-sided, and multi-layered boards.

ONESEINE'S STANDARD FR-4 MATERIAL PROPERTIES

High Glass Transition Temperature (Tg) (150Tg or 170Tg)

High Decomposition Temperature (Td) (> 345º C)

Low Coefficient of Thermal Expansion (CTE) ((2.5%-3.8%)

Dielectric Constant (@1 GHz): 4.25-4.55

Dissipation Factor (@ 1 GHz): 0.016

UL rated (94V-0, CTI = 3 minimum)

Compatible with standard and lead-free assembly.

Laminate thickness available from 0.005” to 0.125”

Pre-preg thicknesses available (approximate after lamination):

(1080 glass style) 0.0022”

(2116 glass style) 0.0042”

(7628 glass style) 0.0075”

FR4 PCB Applications:

FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The copper thickness or copper weight can vary and so is specified separately.

FR-4 is also used in the construction of relays, switches, standoffs, busbars, washers, arc shields, transformers and screw terminal strips.

The requirements of high frequency pcb material:

(1) the dielectric constant (Dk) must be very stable

(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.

(3) and copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.

(4) low water absorption, high water absorption will be affected in the damp when the dielectric constant and dielectric loss.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.