Active Member
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[China]
Address: Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
Contact name:Jerry He
Topmatch Electronics (Suzhou) Co., Limited. |
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0.95mm Anylayer HDI / 12Layer mainboard / EM370D CCL / UFS and OSC area OSP treatment
• IPC-DD-135 Qualification Testing for Deposited Organic Interlayer
Dielectric Materials for Multichip Modules (8/95)
• IPC-2226 Sectional Design Standard for High Density Interconnect
(HDI) Boards (04/03)
• IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI)
and Microvia (06/00)
• IPC-6016 Qualification & Performance Specification for High
Density Interconnect (HDI) Layers or Boards (05/99)
• IPC-4104 Specification for High Density Interconnect (HDI) and
Microvia Materials (5/99)
1 . Descriptions:
What is a HDI PCB?
HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.
Regarding the electrical needs of high-speed signal, the board
should have various features i.e. high-frequency transmission
capability, impedance control, decreases redundant radiation, etc.
The board should be enhanced in the density because of the
miniaturization and arrays of the electronic parts. In addition, to
the result of the assembling techniques of leadless, fine pitch
package and direct chip bonding, the board is even featured with
exceptional high-density.
Innumerable benefits are associated with HDI PCB, like high speed,
small size and high frequency. It is the primary part of portable
computers, personal computers, and mobile phones. Currently, HDI
PCB is extensively used in other end user products i.e. as MP3
players and game consoles, etc.
2 . Specifications:
| Name | 0.95mm Anylayer HDI / 12L mainboard |
| Number of Layers | 12 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | EM370(D) |
| Thickness | 0.95mm |
| Min Track/Spacing | 50um/60um |
| Min Hole Size | Laser 75um; Drilling size 200um |
| Solder Mask | Blue |
| Silkscreen | White |
| Surface Finish | Immersion gold,OSP |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
3. Advantages:
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
