Active Member
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[China]
Address: Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
Contact name:Jerry He
Topmatch Electronics (Suzhou) Co., Limited. |
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OEM Making machine circuit board aluminum plain copper clad Flexible HDI SMT Assemble
HDI inherently provides a better signal integrity performance than non-HDI because all the stray capacitances and inductances get reduced when using small blind and buried vias. Since there are no stubs, the impedance of microvias is close to the trace impedance. The stray capacitance of a normal via is much higher, which causes a greater discontinuity in impedance than a microvia does. Some of the significant differences between the HDI and conventional PCBs are listed below:
1 . Descriptions:
What is a HDI PCB?
HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.
Regarding the electrical needs of high-speed signal, the board
should have various features i.e. high-frequency transmission
capability, impedance control, decreases redundant radiation, etc.
The board should be enhanced in the density because of the
miniaturization and arrays of the electronic parts. In addition, to
the result of the assembling techniques of leadless, fine pitch
package and direct chip bonding, the board is even featured with
exceptional high-density.
Innumerable benefits are associated with HDI PCB, like high speed,
small size and high frequency. It is the primary part of portable
computers, personal computers, and mobile phones. Currently, HDI
PCB is extensively used in other end user products i.e. as MP3
players and game consoles, etc.
2 . Specifications:
| Name | 1.0mm thermal bar 12 Anylayer HDI / Optical module board |
| Number of Layers | 12 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | EM528K |
| Thickness | 1.0mm |
| Min Track/Spacing | 50um/60um |
| Min Hole Size | Laser 75um; Drilling size 200um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | ENEPIG |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
3. Advantages:
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
