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1oz Hdi High Density Interconnect Boards Compact Design

Topmatch Electronics (Suzhou) Co., Limited.
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Topmatch Electronics (Suzhou) Co., Limited.

1oz Hdi High Density Interconnect Boards Compact Design

Country/Region china
City & Province suzhou jiangsu
Categories Bromide
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Product Details

High TG FR4 HDI Printed Circuit Boards Manufacture Multilayer PCB

What are the advantages of HDI PCBs?

  • Phenomenal versatility: HDI boards are ideal where weight, space, reliability, and performance are primary concerns.
  • Compact design: The combination of blind vias, buried vias, and microvias brings down the board space requirement.
  • Better signal integrity: HDI incorporates via-in-pad and blind via technology. This helps in placing the components closer to each other which cuts down the signal path length. The HDI technology removes via stubs and therefore reduces reflections of signal and thus improving signal quality. It therefore remarkably improves signal integrity due to shorter signal paths. Also read: Signal Integrity: Via Stubs and Their Effects on Signal Attenuation and Data Transfer Rates
  • High reliability: The implementation of stacked vias make these boards a super shield against extreme environmental conditions.
  • Cost-effective: The functionality of a standard 8-layer through-hole board (standard PCB) can be reduced to a 6-layer HDI board without compromising the quality.

 

1 . Descriptions:

 

What is a HDI PCB?

 

HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.


Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.


Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.

 

2 . Specifications:

 

Name1.0mm flexible 12 Anylayer HDI / Optical module board
Number of Layers12
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialEM528K
Thickness1.0mm
Min Track/Spacing50um/60um
Min Hole SizeLaser 75um; Drilling size 200um
Solder MaskBlue
SilkscreenWhite
Surface FinishENEPIG
Finished Copper12um
Production time10-21 working days
Lead time2-3 days

 

 

3. Advantages:

 

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

 

 

 

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