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Hdi Rigid Flex Pcb Hdi Technology 10Layer High Density Interconnect Pcbs

Topmatch Electronics (Suzhou) Co., Limited.
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Address: Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C

Contact name:Jerry He

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Topmatch Electronics (Suzhou) Co., Limited.

Hdi Rigid Flex Pcb Hdi Technology 10Layer High Density Interconnect Pcbs

Country/Region china
City & Province suzhou jiangsu
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Product Details

High Precision Multilayer PCB Printed Circuit Boards Blind And Buried Via/Flexible PCB Hdi Pcb

 

  • High Thermal Reliability
  • Ultra-Low Loss
  • High Speed Digital
  • Halogen-Free
  • RoHS Compliant
  • Lead-Free High Tg

 

1 . Descriptions:

 

What is a HDI PCB?

 

HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.


Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.


Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.

 

2 . Specifications:

 

Name10L Tablet computer mainboard
Number of Layers10 
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialEM370
Thickness0.7mm
Min Track/Spacing50um/60um
Min Hole SizeLaser 75um; Drilling size 200um
Solder MaskGreen
SilkscreenWhite
Surface FinishImmersion gold,OSP
Finished Copper12um
Production time10-21 working days
Lead time2-3 days

 

 

3. Advantages:

 

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

 

 

 

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