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Ceramics 10KA 10 Times GDT Gas Discharge Tube Circuit Protection Components

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Ceramics 10KA 10 Times GDT Gas Discharge Tube Circuit Protection Components

Country/Region china
City & Province dongguan guangdong
Categories Battery Chargers
InquireNow

Product Details

 
2RB-8 Series DIP SMD Circuit Protection Components Surge Protector Arrester 75V-800V Arrestor 10KA Gas Discharge Tube
 
Description 

GDT is placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage caused by transient surge voltages that may result from lightning strikes and equipment switching operations. These devices do not influence the signal in normal operation.
However, in the event of an overvoltage surge, such as a lightning strike, the GDT switches to a low impedance state and diverts the energy away from the sensitive equipment.
 
Our GDT offer a high level of surge protection, a broad voltage range, low capacitance, and many form factors including new surface mount devices, which makes them suitable for applications such as Main Distribution Frame (MDF) modules, high data-rate telecom applications (e.g. ADSL, VDSL), and surge protection on power lines. Their low capacitance also results in less signal distortion. When used in a coordinated circuit protection solution with PolySwitch devices, they can help equipment manufacturers meet stringent safety regulatory standards.
 
 
Features
 
Excellent response to fast rising transients

 Stable breakdown voltage

 GHz working frequency

 8/20μs Impulse current capability: 10KA

 Non-Radioactive

 Ultra Low capacitance (<1.5pF)

 Lead-free compliant

 RoHS and REACH compliant

 UL 497B Recognized: E465335

 Size: Ф8mm*6mm

 Storage and operational temperature: -40~+90°C
 
Applications
 

• MDF modules

 

• xDSL equipment

 

• RF systems

 

• Antenna

 

• Base stations

 

• Repeaters, Modems

 

• Telephone Interface, Line cards

 

• Data communication equipment

 

• Line test equipment

 

• Power supplies

 

• Surge protectors, Alarm systems

 
Part Number Code
Electrical Characteristics
 
Part NumberDC
Spark-over Voltage 1) 2) @100V/S
Impulse Spark-over VoltageInsulation Resistance
3)
Capacitance @1MHzLife Ratings
Impulse Discharge Current @8/20μSAC Discharge Current @50Hz 1SImpulse Life @10/1000μS 100A
100V/μS1KV/μS
MaxMaxMinMaxNominal
±5 times
Max 1 timeNominal 5 timesMin
DIPSMDVVVpFKAKAATimes
2R075TB-82R075SB-875±20%50060011.5102010300
2R090TB-82R090SB-890±20%50060011.5102010300
2R150TB-82R150SB-8150±20%50060011.5102010300
2R230TB-82R230SB-8230±20%60070011.5102010300
2R250TB-82R250SB-8250±20%60070011.5102010300
2R300TB-82R300SB-8300±20%75085011.5102010300
2R350TB-82R350SB-8350±20%80090011.5102010300
2R400TB-82R400SB-8400±20%85095011.5102010300
2R420TB-82R420SB-8420±20%900100011.5102010300
2R470TB-82R470SB-8470±20%1000110011.5102010300
2R600TB-82R600SB-8600±20%1000120011.5102010300
2R800TB-82R800SB-8800±20%1400160011.5102010300
Glow Voltage at 10mA........................................................................ ~60V
Arc Voltage at 1A ~10V
Glow to Arc transition Current………………………………………...... ~0.5A
Weight…………………………………………………………………...... DIP ~1.5g
SMD ~1.25g
Operation and storage temperature……………………………………. -40~+90°C
Climatic category (IEC 60068-1) 40/90/21
Surface treatment……………………………………………………...... DIP -Nickel Plated
SMD -Matte-tin plated

 

 

1) At delivery AQL 0.65 level II, DIN ISO 2859


2) In ionized mode


3) Insulation Resistance Measuring Voltage:


75V at DC 25V
90V~150V at DC 50V
Other at DC 100V


Terms in accordance with ITU-T Rec. K.12, IEC 61643-311, GB/T 9043.

 

Dimensions (Unit: mm/inch)

 

SMD Series (2RxxxSB-8)

Packaging Information (Unit: mm/inch)

 

Axial Packaging (Bulk)

 
 

Packaging Quantity

 
100 PCS per Plastic Tray
 
5 Plastic Trays per inner box
 
500 PCS per inner box

 

Axial Packaging (Tape & Reel)

Packaging Quantity

 
500 PCS per reel (13”)
 
3 reels per inner box
 
1,500 PCS per inner box
 

Soldering Parameters - Wave soldering (Thru-Hole Devices)

Wave Soldering ConditionPb-Free assembly
PreheatTemperature Min100°C
Temperature Max150°C
Time (Min to Max)60-180 Seconds
Solder Pot Temperature280°C Max
Solder Dwell Time2-5 Seconds

 

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Reflow ConditionPb - Free assembly
Preheat-Temperature Min (Ts(min))150°C
-Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 -180 Seconds
Average ramp up rate ( Liquids Temp TL) to peak3°C/second max
TS(max) to TL - Ramp-up Rate5°C/second max
Reflow- Temperature (TL) (Liquids)217°C
- Time (min to max) (ts)60 -150 Seconds
Peak Temperature (TP)260 +0/-5°C
Time within 5°C of actual peak Temperature (tp)10 - 30 Seconds
Ramp-down Rate6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max
Do not exceed260°C
 

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