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5.5x6mm GDT Gas Discharge Tube Surge Protector For Frequency Drivers VFDs

Dongguan Tianrui Electronics Co., Ltd

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5.5x6mm GDT Gas Discharge Tube Surge Protector For Frequency Drivers VFDs

Country/Region china
City & Province dongguan guangdong
Categories Solar Chargers
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Product Details

 
2RB-5 Series 5.5x6mm 10kA GDT Gas Discharge Tube Surge Protector for Frequency Drivers VFDs
 
Description

GDT is placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage caused by transient surge voltages that may result from lightning strikes and equipment switching operations. These devices do not influence the signal in normal operation.
However, in the event of an overvoltage surge, such as a lightning strike, the GDT switches to a low impedance state and diverts the energy away from the sensitive equipment.
 
Our GDT offer a high level of surge protection, a broad voltage range, low capacitance, and many form factors including new surface mount devices, which makes them suitable for applications such as Main Distribution Frame (MDF) modules, high data-rate telecom applications (e.g. ADSL, VDSL), and surge protection on power lines. Their low capacitance also results in less signal distortion. When used in a coordinated circuit protection solution with PolySwitch devices, they can help equipment manufacturers meet stringent safety regulatory standards.
 
 
Features
 
 Excellent response to fast rising transients

 Stable breakdown voltage

 GHz working frequency

 8/20μs Impulse current capability: 10KA

 Non-Radioactive

 Ultra Low capacitance (<1pF)

 Lead-free compliant

 RoHS and REACH compliant

 UL 497B Recognized: E465335

 Size: Ф5.5mm*6mm

 Storage and operational temperature: -40~+90°C
 
Applications
 
 CATV equipment

 Antennas

 RS 485

 Telecom Base Station

 Power Supply AC Main

 EV power Charging

 Inverter/Variable

 Frequency Drivers (VFDs)

 IEEE 802.3 compliant Ethernet interfaces
 
 Broad Band equipment

 xDSL, ADSL, ADSL2, VDSL, and VDSL2

 Medical Electronics

 Test Equipment

 General Telecom Equipment

 Renewable Energy
 
Part Number Code
 
Electrical Characteristics
 
Part NumberDC
Spark-over Voltage 1) 2) @100V/S
Impulse Spark-over VoltageInsulation Resistance
3)
Capacitance @1MHzLife Ratings
Impulse Discharge Current @8/20μSAC Discharge Current @50Hz 1SImpulse Life @10/1000μS 100A
100V/μS1KV/μS
MaxMaxMinMaxNominal
±5 times
Max 1 timeNominal 5 timesMin
DIPSMDVVVpFKAKAATimes
2R075TB-52R075SB-575±20%50060011101210300
2R090TB-52R090SB-590±20%50060011101210300
2R150TB-52R150SB-5150±20%50060011101210300
2R230TB-52R230SB-5230±20%60070011101210300
2R250TB-52R250SB-5250±20%60070011101210300
2R300TB-52R300SB-5300±20%75085011101210300
2R350TB-52R350SB-5350±20%80090011101210300
2R420TB-52R420SB-5420±20%85095011101210300
         10300
Glow Voltage at 10mA........................................................................ ~60V
Arc Voltage at 1A ~10V
Glow to Arc transition Current………………………………………...... ~0.5A
Weight…………………………………………………………………...... DIP ~0.82g
SMD ~0.55g
Operation and storage temperature……………………………………. -40~+90°C
Climatic category (IEC 60068-1) 40/90/21
Surface treatment……………………………………………………...... DIP -Nickel Plated
SMD -Matte-tin plated

 

2R470TB-52R470SB-5470±20%9001000111012
 

 

 

1) At delivery AQL 0.65 level II, DIN ISO 2859


2) In ionized mode


3) Insulation Resistance Measuring Voltage:


75V at DC 25V


90V~150V at DC 50V


Other at DC 100V


Terms in accordance with ITU-T Rec. K.12, IEC 61643-311, GB/T 9043.

 

Dimensions (Unit: mm/inch)

 

DIP Series (2RxxxTB-5)

SMD Series (2RxxxSB-5)

 

Packaging Information (Unit: mm/inch)

 

 

Packaging Quantity

 
100 PCS per Plastic Tray
 
5 Plastic Trays per inner box
 
500 PCS per inner box
 

Axial Packaging (Tape & Reel)

 
 

Soldering Parameters - Wave soldering (Thru-Hole Devices)

 
 
Wave Soldering ConditionPb-Free assembly
PreheatTemperature Min100°C
Temperature Max150°C
Time (Min to Max)60-180 Seconds
Solder Pot Temperature280°C Max
Solder Dwell Time2-5 Seconds

 

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Reflow ConditionPb - Free assembly
Preheat-Temperature Min (Ts(min))150°C
-Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 -180 Seconds
Average ramp up rate ( Liquids Temp TL) to peak3°C/second max
TS(max) to TL - Ramp-up Rate5°C/second max
Reflow- Temperature (TL) (Liquids)217°C
- Time (min to max) (ts)60 -150 Seconds
Peak Temperature (TP)260 +0/-5°C
Time within 5°C of actual peak Temperature (tp)10 - 30 Seconds
Ramp-down Rate6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max
Do not exceed260°C
 

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