Results forfr4 ic packaging substratefrom 45681 Products.
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Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC ...
china
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JEDEC Standard Plastic JEDEC Matrix Trays for IC Packaging Customized JEDEC Standard Design Tray For IC Parts JEDEC tray is the packaging tray used by the enterprise for its chip ...
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5CGXFC5C6F27I7N FPGA IC Package size 672FBGA Voltage Supply 1.07V to 1.13V XILINX Field Programmable Gate Array IC Chip As a professional electronic components distributor we can ...
china
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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, ...
china
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Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil ...
china
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High Temperature Standard Jedec Tray IC Packaging High Temperature Standard Black Matrix Trays Can Be Used For Loading Sensor IC The tray has a 45-degree chamfer to provide the ...
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MAX8815AETB+T Power Management ICs Boost Switching Regulator IC Package 10-WFDFN Exposed Pad Product Status Active Function Step-Up Output Configuration Positive Topology Boost ...
china
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All types BGA of memory substrate manufacture China Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Short introduction ...
china
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BGA IC Packaging Black Jedec Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray Jedec Tray/Matrix Tray/IC Tray/ESD Packing Tray ...
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Application:Flash memory pacakge,NAND memory substrate package,Memory electronics,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished ...
china
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Through Hole Structure IC Packaging Tray Lightweight Moisture Proof Through Hole Structure Plastic ESD Trays For Loading Electronic Components Our company has skillful and well...
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Ultrathin High Quality MEMS PCB for Microphone Application:MEMS,sensor MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of Substrate production: Mini.Line ...
china
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Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini.Line space/width:1mil (25um) ...
china
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stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with different functions to provide multi...
china
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Application:IOT electronics,Automotive electronics,new energy automobile,auto-Driving electronics,consumer electronics,others; Spec.of substrate production: Mini.Line space/width...
china
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Application:NAND memory package,Memory electronics,storage electronics,Flash memory,FBGA/PBGA package,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil ...
china
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Application:IoT electronics,Home electronics,Consumer electronics,Car electronics,Smart electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ...
china
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Application:Smart electronics,Smart healthy electronics,Smart agricultural electronics,IoT industry electronics,Smart express electronics ,others; Spec.of Substrate production: ...
china
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Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; ...
china
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Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.24mm; Material brand:Mainly ...
china
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