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Pigmentation Removal CO2 Fractional Laser Machine For Skin Resurfacing 25W

Beijing Globalipl Development Co., Ltd.
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Address: Room801 Qunyinghui Building #3, JinFu Rd. No.3 2, DaXing Economic Development Zone, Beijing. 102600

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Beijing Globalipl Development Co., Ltd.

Pigmentation Removal CO2 Fractional Laser Machine For Skin Resurfacing 25W

Country/Region china
City & Province beijing beijing
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Product Details

 

Pigmentation Removal CO2 Fractional Laser Machine For Skin Resurfacing 25W

 

 

I.Theory

Unlike traditional laser, fractional laser will only cover part of the skin tissue, leaving the surrounding tissue intact, and then cause a series biochemical reactions inside the skin, thus to reach the results of skin lifting & resurfacing, pigments and scar removal, etc, finally let the skin return to young again. The unaffected areas act as a reservoir for more effective and rapid tissue healing and collagen production, thus lift the skin and removes speckles and pigments.

  

a)     Red areas are the zones of ablation in fully ablative standard resurfacing, which need longer healing time;

b)     Red areas are the microscopic treatment zones (MTZs) of fractional photothermplysis (FP) and the blue areas are the bridge of intact, unaltered skin which will stimulate collagen production, thus faster recovery as well as enhance effective.

c)     White dots are fractional laser on skin.

 

 

 

II.Applications:

 1.    Skin renewing and resurfacing

 2.    Wrinkle removal, skin tightening

3.    Acne and acne scar removal

4.    Smooth burnt scars and surgery scars, etc

 5.    Remove intractable chloasmas and pigmentation

 6.    Sun damage recovery

 

 

III. Features:

1Radio frequency co2 fractional laser

2. Individual design of laser structure, greatly facility laser replacement and easy daily manintenace

3. Display: 8.4" color touch LCD screen

4. Humanized software control, stable laser output, more safety

5. Smart articular arm, high accuracy

6. Excellent performance, not affect people's normal life and study

7. Packing: aluminum alloy case

 

 

IV. Parameters:

Basic specification

Wavelength

10.6μm, far-infrared laser

Control

LCD 8.4 inch

Pulse frequency

33.3 Hz

Duration

0.1~10 ms

Distance

0.1~2.6 mm

Interval

0~6s

Repeat

1~5000ms

overlap

1~20 times

Average power

25W

Working mode:

Continuous pulse, single pulse, interval pulse

Scan Graphics

Square, rectangle, round, triangle, oval, 6-diamond shape, line

Dot quantity

400 dots at most

Working state

Hyper-pulsed mode

Scan mode

Sequence scan, Random scan, maximum distance scan

Pulse energy

10mj to 130mj is optional for each dot.

Technical specification

Condenser focus

f=50mm

Beam divergence angle

0.3 mrad

Spot size

0.1 mm

Aiming beam

Less than 2mW, 635nm red semiconductor laser

Cooling system

air cooling

Environment temperature

5-400C

Relative humidity

<80%

Temperature in transit

-40-500C

Humidity in transit

<85%

Beam transport device

Articulated arm with 7-joint and balance weight

Atmospheric pressure

86.0kpa-106.0kpa

Warming up time

2 min

Electromagnetic requirement

No electromagnetic

Field interference

N. weight (kg)

22kg

Power supply

220V/110V

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