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Rogers 25mil 0.635mm TMM10 Microwave PCBs Chemical Gold and Green Solder Mask for Dielectric Polarizers and Lenses

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Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers 25mil 0.635mm TMM10 Microwave PCBs Chemical Gold and Green Solder Mask for Dielectric Polarizers and Lenses

Country/Region china
City & Province shenzhen guangdong
Categories Other Welding & Soldering Supplies
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Product Details

Rogers 25mil 0.635mm TMM10 Microwave PCBs Chemical Gold and Green Solder Mask for Dielectric Polarizers and Lenses

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.

 

The electrical and mechanical properties of TMM10 laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.

 

TMM10 laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM10 laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.

 

TMM10 laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.

 

 

Some Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

 

Our Capabilities (TMM10)

PCB Material:Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:TMM10
Dielectric constant:9.20 ±0.23
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

 

 

Data Sheet of TMM10

TMM10 Typical Value
Property TMM10DirectionUnitsConditionTest Method
Dielectric Constant,εProcess9.20±0.23Z 10 GHzIPC-TM-650 2.5.5.5
Dielectric Constant,εDesign9.8--8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor (process)0.0022Z-10 GHzIPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant-38-ppm/°K-55℃-125℃IPC-TM-650 2.5.5.5
Insulation Resistance>2000-GohmC/96/60/95ASTM D257
Volume Resistivity2 x 108-Mohm.cm-ASTM D257
Surface Resistivity4 x 107-Mohm-ASTM D257
Electrical Strength(dielectric strength)285ZV/mil-IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)425425℃TGA-ASTM D3850
Coefficient of Thermal Expansion - x21Xppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y21Yppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z20Zppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity0.76ZW/m/K80 ℃ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress5.0 (0.9)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)13.62X,YkpsiAASTM D790
Flexural Modulus (MD/CMD)1.79X,YMpsiAASTM D790
Physical Properties
Moisture Absorption (2X2)1.27mm (0.050")0.09-%D/24/23ASTM D570
3.18mm (0.125")0.2
Specific Gravity2.77--AASTM D792
Specific Heat Capacity0.74-J/g/KACalculated
Lead-Free Process CompatibleYES----

 

 

 
 
 

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