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Kappa 438 High Frequency Printed Circuit Board Rogers 20mil 0.508mm DK 4.38 PCB with Immersion Gold

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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

Kappa 438 High Frequency Printed Circuit Board Rogers 20mil 0.508mm DK 4.38 PCB with Immersion Gold

Country/Region china
City & Province shenzhen guangdong
Categories Electrical Wires
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Product Details

Kappa 438 High Frequency Printed Circuit Board Rogers 20mil 0.508mm DK 4.38 PCB with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.
 
Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.
 
Features
1. Glass reinforced hydrocarbon thermoset platform
2. Dk of 4.38 is tailored to FR-4 industry standard norms
3. Tighter Dk and thickness tolerance than FR-4
4. Low Z Axis CTE of 42 ppm/°C
5. High Tg of > 280°C TMA
6. Meets UL 94-V0 requirements
 

 
Benefits
1. Ease of PCB manufacturing and assembly in Line with FR-4
2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
3. Consistent circuit performance
4. Improved design flexibility and plated through-hole reliability
5. Automated assembly compatible
 
Typical Applications:
1. Carrier Grade WiFi/Licensed Assisted Access (LAA)
2. Small Cell and Distributed Antenna Systems (DAS)
3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
4. Internet of Things (IoT)
Segments: Smart Home and Wireless Meters
 


 
Our PCB Capability (Kappa 438)

PCB Material:Glass Reinforced Hydrocarbon Ceramic
Designation:Kappa 438
Dielectric constant:4.38
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm)
PCB thickness:20mil (0.508mm) 30mil(0.762mm) 40mil(1.016mm) 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

 
 
Data Sheet of Kappa 438 Laminate

PropertyTypical Value Kappa 438DirectionUnitsConditionTest Method
Dielectric Constant, er Design4.38Z-2.5 GHzDifferential Phase Length Method
Dissipation Factor tan, d0.005Z-10 GHz/23°CIPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e-21-ppm/°C10 GHz (-50 to 150°C)Modified IPC-TM-650 2.5.5.5
Volume Resistivity2.9 x 109-MΩ•cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity6.2 x 107-MΩCOND AIPC-TM-650 2.5.17.1
Electrical Strength675ZV/mil-IPC-TM-650 2.5.6.2
Tensile Strength16 12MD CMDkpsi-ASTM D3039/D3039-14
Flexural Strength25 19MD CMDkpsi-IPC-TM-650 2.4.4
Dimensional Stability-0.48-0.59MD CMDmm/m-IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion13Xppm/°C-55 to 288°CIPC-TM-650 2.4.41
16Y
42Z
Thermal Conductivity0.64ZW/(m.K)80°CASTM D5470
Time to Delamination (T288)>60-minutes288°CIPC-TM-650 2.4.24.1
Tg>280-°C TMA-IPC-TM-650 2.4.24.3
Td414-°C-IPC-TM-650 2.3.40
Moisture Absorption0.07-%24/23IPC-TM-650 2.6.2.1
Young’s Modulus2264 2098MD CMDkpsi-ASTM D3039/D3039-14
Flex Modulus2337 2123MD CMDkpsi-IPC-TM-650 2.4.4
Bow0.03-%-IPC-TM-650 2.4.22C
Twist0.08-%-IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress5.8-lbs/in1 oz (35 µm) foilIPC-TM-650 2.4.8
FlammabilityV-0---UL 94
Specific Gravity1.99-g/cm3-ASTM D792
Lead-Free Process CompatibleYes--- 
 
 

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