Active Member
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[China]
Address: Room 36B1-B2, Building C, Electronics Science & Technology Building Shennan Mid-Road, Shenzhen China
Contact name:Sharon Yang
Anterwell Technology Ltd. |
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IRFP044N HEXFET® Power MOSFET
• Advanced Process Technology 
• Dynamic dv/dt Rating
• 175°C Operating Temperature
• Fast Switching
• Fully Avalanche Rated
Description
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because of its isolated mounting hole.
Absolute Maximum Ratings
| Parameter | Max. | Units | |
|---|---|---|---|
| ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V | 53 | A |
| ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V | 37 | A |
| IDM | Pulsed Drain Current | 180 | A |
| PD @TC = 25°C | Power Dissipation | 120 | W |
| Linear Derating Factor | 0.77 | W/°C | |
| VGS | Gate-to-Source Voltage | ± 20 | V |
| EAS | Single Pulse Avalanche Energy | 230 | mJ |
| IAR | Avalanche Current | 28 | A |
| EAR | Repetitive Avalanche Energy | 12 | mJ |
| dv/dt | Peak Diode Recovery dv/dt | 5.0 | V/ns |
| TJ, TSTG | Operating Junction and Storage Temperature Range | -55 to + 175 | °C |
| Soldering Temperature, for 10 seconds | 300 (1.6mm from case ) | °C | |
| Mounting torque, 6-32 or M3 screw | 10 lbf•in (1.1N•m) |
Stock Offer (Hot Sell)
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