Active Member
|
[China]
Address: Room 36B1-B2, Building C, Electronics Science & Technology Building Shennan Mid-Road, Shenzhen China
Contact name:Sharon Yang
Anterwell Technology Ltd. |
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BCP54; BCP55; BCP56
NPN medium power transistors
FEATURES
• High current (max. 1 A)
• Low voltage (max. 80 V).
APPLICATIONS
• Switching.
DESCRIPTION
NPN medium power transistor in a SOT223 plastic package.
PNP complements: BCP51, BCP52 and BCP53.
PINNING
| PIN | DESCRIPTION |
| 1 | base |
| 2,4 | collector |
| 3 | emitter |
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134)
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VCBO | collector-base voltage BCP54 BCP55 BCP56 | open emitter |
− − − |
45 60 100 | V |
| VCEO | collector-emitter voltage BCP54 BCP55 BCP56 | open base | − − − |
45 60 80 | V |
| VEBO | emitter-base voltage | open collector | - | 5 | V |
| IC | collector current (DC) | - | 1 | A | |
| ICM | peak collector current | - | 1.5 | A | |
| IBM | peak base current | - | 0.2 | A | |
| Ptot | total power dissipation | Tamb ≤ 25 °C; note 1 | - | 1.33 | W |
| Tstg | storage temperature | -65 | +150 | °C | |
| Tj | junction temperature | - | 150 | °C | |
| Tamb | operating ambient temperature | -65 | +150 | °C |
Note 1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2. For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”.
PACKAGE OUTLINE
Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223
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