Results for110mm industrial heat sinkfrom 51900 Products.
|
|
heat sink pad For GPS navigation and other portable devices, >5500 VAC,.1.2W/mK Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to ...
|
|
|
|
|
3.5mmT RoHS Compliant Heat Sink Pad for Heat Pipe Thermal Solutions The TIF7140M is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional ...
|
|
|
|
|
Semiconductor Heat Sink 99% Alumina Thin Brick Plate Tile Product Description Cement Kiln with Good Heat Resistant Firing High Alumina Refractory Brick are mainly made from ...
|
|
|
|
|
Heat Sink Extruded Aluminium Profile , Anodizing Surface Treatment Specifications: o Extruded aluminum profile o Aluminum extrusion Al6063-T5 o Black anodize o Lead time: 12 days o ...
|
|
|
|
|
TEC Heat Sink Thermoelectric Cooler Module , Teg Peltier Module Thermoelectric Benefits • TE coolers contain no chlorofluorocarbons or other materials which may require periodic ...
|
|
|
|
|
Wholesale Thermally Conductive Putty For Heat sink any Heat Generating Semiconductor Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting ...
|
|
|
|
|
LED Heat Sink High Adhesive Tape , Thermal Adhesive Aluminum Foil Tape RoHs The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and ...
|
|
|
|
|
LED Heat Sink Aluminum Foil Adhesive Tape with High Thermal Conductivity 1.6 W /mK The TIA™800AL Series products are mostly used for bonding heat dissipation fins, microprocessors ...
|
|
|
|
|
Glass Fiber Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA™808FG Series products are mostly used for bonding heat dissipation fins, ...
|
|
|
|
|
Heat Sink Thermal Conductive Acrylic Based Adhesive High Bond Strength 10" x 18" Size The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocesso...
|
|
|
|
|
Black 5.0W / mk TCP100-50-01A Nylon Heat Sinking 150℃ Thermal Conductive Engineer Plastic 2.5～3.5kJ/m2 for LED light TCP™100-50-01A is a Thermally Conductive Engineering Plastic ...
|
|
|
|
|
The TIA™810FG Acrylic Thermally Adhesive Tape For LED Mount Heat Sink Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, ...
|
|
|
|
|
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, ...
|
|
|
|
|
White 130℃ PP Heat Sinking Thermal Conductive Plastic TCP 100-01PP , 1 W-mK , RoHs and UL 1.55g/cm3, 94V0 TCP 100-01PP is a Thermally Conductive Engineering Plastic developed for ...
|
|
|
|
|
Dielectric Constant 5.0 MHz Conductive Pads Easy Release Construction for LED Controller The TIF1160-30-06UF use a special process, with silicone as the base material, adding ...
|
|
|
|
|
IGBTs Phase Change Material Heat Sink 0.024℃-in² / W With Low Thermal Resistance Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, ...
|
|
|
|
|
LED Heat Sinking Housing Thermal Conductive Pad 4.7 W / mK for Uneven Surfaces Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many ...
|
|
|
|
|
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™800A Series begins ...
|
|
|
|
|
4W/MK Heat Sink Pad Sheet For LED Ceilinglight Pink TIF100-40-14E , 35 Shore 00 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite ...
|
|
|
|
|
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™808A Series begins ...
|
|
|
You may also be interested in :
