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High Frequency Rigid Flex Circuit Board FR4 High TG Immersion Tin PCB

Huashengxin Circuit Limited
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Address: RM1510, YUNHUA TIMES, Shajing Street, Baoan District, Shenzhen,Guangdong, China

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Huashengxin Circuit Limited

High Frequency Rigid Flex Circuit Board FR4 High TG Immersion Tin PCB

Country/Region china
City & Province shenzhen guangdong
Categories Other Electronic Components
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Product Details

High Frequency Rigid Flex Circuit Board FR4 High TG Immersion Tin Pcb

 

 

 

Max layers: 32layer (≥20 layer needs to review)

Max finish panel size: 740* 500 MM(>600 MM needs to review)
PCB material: PI +FR4,FR4, Rogers,Halogen-free, High TG and heavy copper
PCB thickness: 0.2~4.0mm(<0.2 mm,>4 mm needs to review)

PCB copper thickness: H~5oz

Min. hole size: 0.15mm(<0.15 mm needs to review)

Max hole size: 6.0mm(>6mm, use milling to enlarge holes)

HDI Min drill hole: 0.08-0.10MM

Min space in inner layer(one-sided): 4~8L(include): sample: 4 mil; small volume: 4.5 mil;

8~12L(include): sample: 5 mil; small volume: 5.5 mil

12~18L(include): sample: 6 mil; small volume: 6.5 mil

PCB solder mask: Green, Matt green,Blue, Matt blue, Black, Matt black, Yellow, Red, White,etc
PCB silkscreen: White, Black, etc
PCB surface: HASL lead free,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger

Application: Communications, Industry/comsumer Electronic.

 

 

PCB LayerRigid Flex PCB(4L)
PCB surfaceImmersion gold
PCB materialFR-4, TG170+PI
PCB thickness2.0mm
Min. hole size0.2mm
Min. line Spacing3mil(0.075mm)
PCB profile

Routing and V-CUT

PCB solder maskGreen, both side
PCB silkscreenWhite, both sides
PCB copper thickness2/2/2/2oz finished
Other servicePCB assembly, prototype order

 

 

 

Quick turn PCB manufacturing (2layer 24hours, 4layer 48hours…. Fastest )

FR4 , Aluminum, Flexible, Rogers, Teflon PCB mass production

Multi-Layered PC Board (4-32 layers)

Low to high volume surface mount and through-hole PCB assembly

01005s, BGA, uBGA, CCGA CSP and Flip Chip

0.4mm Fine Pitch Devices

Prototype and pre-production electronic assembly

Surface Mount Technology (Paste and Epoxy)

Encapsulation and conformal coating of PCB assemblies

Lead-Free assembly

Intrusive reflow

Press fit

Wave/Selective wave soldering

Double/Single-sided reflow processing

Rework and repairs (Fine Pitch QFP, Area Array Packages)

Functional, electrical, and in-circuit testing

By managing the end-to-end production process, we enable our customers to concentrate on their core specialties.

 

 

FAQ:

1. What service can you provide?

PCB Manufacture,PCB Assembly,Rapid Prototype

 

2. How fast is your lead time?

Fastest 24H for 2L and 4L, 3WDs for HDI board.

 

3. How to get quick quotation?

Please provide gerber file and details of the board(including layer, board thickness, copper thickness, surface treatment, solder mask and silkscreen color, special request if any, demand quantity, etc)

 

4. What payment terms do you have?

Wire Transfer(T/T)

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