5uM Microfocus X Ray PCB Inspection Machine With FPD 55 Degree Tilting View BGA Soldering Void

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void

Application:

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc.

Standard configuration

1. Adjust the speed of the stage through the space bar: slow, normal, fast

2. Keyboard control X, Y, Z1 Z2 the four-axis movement.

3. The user can control the speed of the stage by programming

Fully automatic BGA detection program

1. Simple mouse click to write program.

2. Automatic analysis on diameter, proportion of cavity, area and roundness of BGA.

3. Automatic BGA detection program has high repeatability of detection results for process control.

4. The test results will be displayed on the screen and can be output to excel for review.

CNC programming

1. Simply mouse click to write detection program.

2. Sample tablecan be positioned in X, Y direction; X-ray optical tube and detector can be positioned in Z direction.

3. Software set voltage and current.

4. Image settings: brightness, contrast, auto gain and exposure.

5. Users can set the pause time for program switching.

6. Anti-collision system can meet the maximum tilt and observation.