Results forwafer semiconductor inspection systemfrom 1515 Products.
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90KV 5um microfocus closed tube X-ray Inspection System with high resolution FPD for PCBA soldering void Defects checki Application Fields of X-ray machine Widely applied for BGA , ...
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Product Description: The AOI Tester Machine is capable of inspecting up to 60cm²/s, making it one of the fastest and most dependable machines on the market. This speed ensures that ...
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4inch dia100m 4H-N type Production grade DUMMY grade SiC substrates, Silicon Carbide substrates for a semiconductor device, 4h-semi 4h-N customized square shape sic wafers ...
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Customized stainless steel automatic waffle basket production line equipment can be installed and debugged Characteristics of Automatic Wafer Cone Machine: 1. The machine is made ...
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Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● ...
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M20EL Series Mini LED luminescence inspection Model M2012EL Inspection Inspection items Bad die, over luminescence, under luminescence, chroma anomaly Inspection method Image ...
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8inch dia200mm 4H-N Production grade dummy grade SiC wafers Production grade DUMMY grade SiC substrates, Silicon Carbide substrates for a semiconductor device, Application areas 1 ...
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Commercial Wafers Biscuitam Ice Creone Maker Baking Machine. Ice Creone Maker Baking Machine Applicable Industries Food & Beverage Factory, Other After Warranty Service Video ...
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Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, ...
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Product Description: The SMT AOI Machine has a movement speed of 800mm/sec, making it one of the fastest AOI machines on the market. It can inspect PCBs with a thickness ranging ...
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Snack Food Processing Wafer Makers Automatic Tart Shell Machines. Automatic Tart Shell Machines main features Can make a variety of tart shell products. extra thick cone batter is ...
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Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED ...
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Product Description: Our SMT AOI Machine comes equipped with a 6.5 Mpix high-speed color camera, providing you with clear and detailed images of your PCBs. The camera has a ...
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High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight ...
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Model RD30K Basic Function Function Defective die removing, residues cleaning, solder paste/adhesive printing, die bonding, solder curing, luminescence inspection Wafer size 3x5mil...
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Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, ...
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FPD 100KV X Ray Inspection System For Capacitor Function & Features Large Size Inspection Table Laser Locator for Precise Location 24’’ FHD Interactive Touch LCD Display Accurate ...
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Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse...
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High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, ...
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Capacitor Inner Defect Inspection with Electronics X-ray 100 KV Power AX8200MAX Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, ...
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