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AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Shenzhen Aochuan Technology Co., Ltd
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Address: 302 GuihuaRoad, GuixiangVillage, GuanlanTown, LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China

Contact name:Jason Zhan

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Shenzhen Aochuan Technology Co., Ltd

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Country/Region china
City & Province shenzhen guangdong
Categories Other Rubber Products
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Product Details

Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting

AttributeValueTest Method
CompositionCeramic Filler + Silicone-
ColorPinkVisual
Thickness (mm)0.5~12.0ASTM d374
Density (g/cc)2.3ASTM D792
Hardness (Shore OO)20±5ASTM D2240
Tensile Strength(kn/m)0.4ASTM D624
Elongation %52ASTM D412
Usage Temperature(℃)-40~150-
Electrical  
Breakdown Voltage(kv/mm)≥6.5ASTM D149
Dielectric Constant(@1mhz)5.3ASTM D150
Volume Resistivity(Ω.cm)1.0*1012ASTM D257
FlammabilityV-0UL94
 Thermal  
Thermal conductivity(W/m.K)1.2±0.1ASTM D5470

 

Product feature:

  • Thermal Conductivity:1.2W/m.K
  • Ultra soft and highly compliant
  • Naturally tacky, easing application
  • Low pressure versus deflection
  • Excellent, high volume applications

Typical applications:

  • Networking and Telecommunications
  • IT: Notebooks, Tablets, Power Conversion
  • Industrial: LEDs, Power Supplies and Conversion
  • Automotive: Control Modules, Turbo Actuators
  • Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

 

 

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