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Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Shenzhen Aochuan Technology Co., Ltd
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Address: 302 GuihuaRoad, GuixiangVillage, GuanlanTown, LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China

Contact name:Jason Zhan

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Shenzhen Aochuan Technology Co., Ltd

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Country/Region china
City & Province shenzhen guangdong
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Product Details

AttributeValueTest Method
CompositionCeramic filler + Silicone-
ColorGreenVisual
Density(g/cc)2.9ASTM D792
Extrudability(g/s)5.0ISO9048
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)≥5.0ASTM D149
Dielectric Constant(@10mhz)7.3ASTM D150
Volume Resistivity(Ω.cm)1.0*1014ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)3.0ASTM D5470

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.K
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300ml Cartridge/1Kg Jar/20KG Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

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