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Copper Tungsten Heat Sink , 115 - 260 Hardness Tungsten Heavy Alloy

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Zhuzhou Teyou New Material Co.,Ltd

Copper Tungsten Heat Sink , 115 - 260 Hardness Tungsten Heavy Alloy

Country/Region china
City & Province zhuzhou hunan
Categories Other Lighting Accessories
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Product Details

WCu Copper Tungsten AlloyTungsten Copper Heat Sink with 50 wt.% Cu

 

Description:

 

Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.

Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.

The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.  

 

Advantages:

 

1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control

4. Semi-finished or finished (Ni/Au plated) products available

5. Low porosity

 

Product Properties:

 

GradeW ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu90±2%17.06.5180 (25℃) /176 (100℃)
85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
50WCu50±2%12.212.5340 (25℃) / 310 (100℃)

 

Application:

 

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

 

 

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