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Surface Mounted Devices CMF Chip NTC Thermistor 0402 0603 0805 1206
4.7K 10K 22K 100K
Description Of The Chip NTC Thermistor 0402 0603 0805 1206
NTC (Negative Temperature Coefficient) Thermistor is a kind of
heat-sensitive semiconductor resistor. Its resistance value
decreases with the increase of temperature. The temperature
coefficient of resistance is in the range of -2%/k~-6%/k, which is
about metal 10 times the temperature coefficient of resistance. The
change of the resistance of NTC thermistor can be caused by the
change of the external environment temperature, or it can be caused
by the current flowing through and self-heating. His various uses
are based on this characteristic. NTC thermistor is made of
polycrystalline ceramic of mixed oxide. The conductive mechanism of
this material is quite complicated.
Application Range Of The Chip NTC Thermistor 0402 0603 0805
1206
• Temperature measurement: gas meter, water heater, electric
kettle, electronic thermometer, electronic perpetual calendar,
electronic clock temperature display, electronic gifts, etc.;
• Temperature control: temperature sensing of rechargeable
batteries in mobile phones, car phones, notebook computers, smart
wearable devices, etc.;
• Temperature compensation: temperature compensation of
transistors, ICs and crystal oscillators of mobile communication
equipment
Features Of The Chip NTC Thermistor 0402 0603 0805 1206
1) Small size, no lead, excellent welding performance, suitable for
high-density surface mount;
2) The surface of the porcelain body is encapsulated by glass,
which has good moisture resistance, high reliability and stability;
3) Wide operating temperature range: -40℃~+150℃;
4) High-precision resistance constants: 2.2K, 4.7K, 10K, 22K, 33K,
47K, 56K, 68K, 100K, 220K, 330K, 470K, 560K,
5) High-precision B value constants: 3380, 3435, 3500, 3600, 3800,
3950, 4050, 4150, 4250, 4350, and other B values
6) Resistance value accuracy: 0.5%, 1%, 2%, 3%, 5%
Dimension Of The Chip NTC Thermistor 0402 0603 0805 1206 (mm)
Size | L | W | T | M |
0402 (1005) | .04± .006 (1.0 ±0.15 ) | .02 ± .004 | .024max (0.60max) | .004min (0.10min) |
0603 (1608 ) | .063 ± .006 (1.6*0.15 ) | .031 ± .006 | .037max (0.95max) | .004min (.0.10min) |
0805 (2012 ) | .08 ± .008 | .05 ± .008 | .05max | .006min (0.15min) |
Specification Of The Chip NTC Thermistor 0402 0603 0805 1206
0402 Series SMD Thermistor Parameters
Part No | Resistance at 25 °C (Ω) | B-value25/85 °C (K) |
CMFX39F103 | 10 | 3950 |
CMFX40F473 | 47 | 4050 |
CMFX40F104 | 100 | 4050 |
0603 Series Chip Thermistor Parameters
Part No | Rdsistance at 25°C (Ω) | B-value25/85°C(K) |
CMFA34F103口 | 10 | 3450 |
CMFA39H103口 | 10 | 3970 |
CMFA39Z223口 | 22 | 3900 |
CMFA39F473口 | 47 | 3950 |
CMFA39F104口 | 100 | 3950 |
CMFA39F224口 | 220 | 3950 |
CMFA35F103口 | 10 | 3550 |
CMFA39F683口 | 68 | 3950 |
CMFA41Z564口 | 560 | 4100 |
0805 Series SMD NTC Thermistor Parameters
Part No | Resistance at 25°C(KΩ) | B-value 25/85 |
CMFB34G472 □ | 4.7 | 3435 |
CMFB34G103 □ | 10 | 3435 |
CMFB35FI03 □ | 10 | 3550 |
CMFC39Z223 □ | 22 | 3900 |
CMFB40Z473 □ | 47 | 4000 |
CMFB40Z104 □ | 100 | 4000 |
CMFB40ZI03 □ | 10 | 3970 |
CMFB32Z202 □ | 2 | 3200 |
CMFB36F153 □ | 15 | 3650 |
CMFB40F333 □ | 33 | 4050 |
1206 Series Chip NTCThermistor Parameters
Part No | Resistance at25 °C (KΩ) | B-value25/50 °C(K) |
CMFC32Z221口 | 0.22 | 3200 |
CMFC32Z331口 | 0.33 | 3200 |
CMFC32F471口 | 0.47 | 3250 |
CMFC32F681口 | 0.68 | 3250 |
CMFC33F102口 | 1.0 | 3350 |
CMFC34Z222口 | 2.2 | 3400 |
CMFC34Z332口 | 3.3 | 3400 |
CMFC34Z472口 | 4.7 | 3400 |
CMFC34Z682口 | 6.8 | 3400 |
CMFC35Z103口 | 10 | 3500 |
CMFC39Z103口 | 10 | 3900 |
CMFC39Z153口 | 15 | 3900 |
CMFC39F223口 | 22 | 3950 |
CMFC40Z333口 | 33 | 4000 |
CMFC41Z473口 | 47 | 4100 |
CMFC41Z683口 | 68 | 4100 |
CMFC42Z104口 | 100 | 4200 |
CMFC43Z224口 | 220 | 4300 |
Application of SMD NTC Thermistor in 5G Electronic Equipment
As 5G technology is widely used in various devices, the 5G era has
finally come. The key differences between 5G and the early 2G, 3G
and 4G mobile communications are:
1. The communication speed, the amount of information processed,
and the connection capacity have been greatly improved to meet the
needs of high-definition images, videos, virtual reality and other
large data transmission and real-time applications such as
automatic driving, telemedicine, and Internet of Things
communication;
2. With continuous wide area coverage and high mobility, the user
experience rate reaches 100Mbit/s.
3. The system is coordinated, and the level of intelligence is
improved, which is manifested as a multi-user, multi-point,
multi-antenna, multi-intake collaborative networking, and flexible
and automatic adjustments between networks.
All of the above features increase the load of related components
in 5G equipment, and the heat source also increases. Multiple heat
sources will also affect heat transfer. The previous measures taken
on a single heat source may not be suitable for processing 5G
electronic equipment at the same time. The status of multiple
feature hotspots.
Based on the above background, it is particularly important to
monitor the temperature of multiple functional hot spots on the
substrate and to control the performance of the heat-generating
component according to the complex functions of the electronic
device.
For example, when the CPU loads a large application program, the
temperature is low in the initial stage and runs at full power. If
the CPU temperature increases, the performance will decrease, and
the threshold temperature control cannot be exceeded. At this time,
if the heat generated by the power supply to the CPU is large and
the CPU can receive the heat from the power supply unit, the
temperature of the CPU may rise sharply. To consider the
temperature around the CPU and around the power IC at the same
time, it is necessary to control the performance of each device
more finely.
While controlling the temperature of the device on the substrate,
it should also be noted that since the heating device continues to
generate heat, it may require final overheating protection-such as
displaying a warning or switching to the off state.
It is necessary to consider the internal temperature of each heat
source, IC, and module on the substrate, as well as the heat
exchange between each other and the temperature change of the
surrounding environment where the electronic device is placed. Only
by monitoring the temperature around the heat source can the
temperature management mentioned above be carried out.
The chip NTC thermistor is suitable for surface mounting as the
same EIA size standard chip resistors, capacitors, inductances,
etc. It has a high degree of freedom in configuration, a small
space, and a simple circuit to obtain the expected accuracy, so the
chip NTC thermistor is very suitable as a temperature sensor to be
placed on the substrate to be measured, to realize the temperature
monitoring of the substrate.