JUKI KE3010 KE3020 Vibration Stick Feeder For Electric Table

SMT SPARE PARTS JUKI KE3010 KE3020 Vibration Stick Feeder For Electric Table

Specification:

Supply Ability:

Supply all original new and used JUKI feeder:

• JUKI E2111721000 BEARING
• JUKI E2111723000 PAD SP
• JUKI E2111725000 PUSHER CYLINDER SUPPORT
• JUKI E2111727000 SENSOR BRACKET AL
• JUKI E21117290A0 XA PULLEY BRACKET L ASM
• JUKI E2111750000 X MOTOR PULLEY
• JUKI E2111755000 X CARRIER PULLEY
• JUKI E21119980A0 "JIG, ATC OFFSET BOSS (6) (V003"
• JUKI E2112706000 STOPPER HOOK 8-4
• JUKI E2112706000A STOPPER HOOK 8-4
• JUKI E2112706C00 HOOK
• JUKI E2112719000 SPACER E
• JUKI E2112721000 BU SHAFT
• JUKI E2112725000 PUSHER CYLINDER BRACKET FL
• JUKI E2112727000 SENSOR BRACKET B
• JUKI E2112729000 XA PULLEY BRACKET R
• JUKI E21127290A0 XA PULLEY BRACKET R ASM
• JUKI E2112750000 X MOTOR BELT
• JUKI E2112755000 X CARRIER BELT
• JUKI E2112998000 "JIG, ATC OFFSET BOSS (6) (V004"
• JUKI E2113715000 SENSOR BRACKET A
• JUKI E2115725000 PUSHER CYLINDER BRACKET FR
• JUKI E21157250A0 PUSHER XR ASM
• JUKI E2115750000 X PULLEY SHAFT
• JUKI E2115755000 X SENSOR PLATE
• JUKI E2115998000 "JIG, ATC OFFSET BOSS (12) (V00"
• JUKI E2116715000 REAR RAIL SUPPORT
• JUKI E2116723000 PAD BLOCK
• JUKI E21167230A0 PAD BLOCK ASM
• JUKI E21167230B0 PAD BLOCK ASM

Related Parts:

SMT Advantages:
Surface mount technology, SMT and its associated surface mount devices, SMDs considerably speed up PCB assembly as the components simply mount on the board.
Look inside any piece of commercially made electronic equipment these days and it is filled with minute devices. Rather than using traditional components with wire leads like those that may be used for home construction and kits, these components are mounted onto the surface of the boards and many are minute in size.

1. Good mechanical performance under shock and vibration conditions (partly due to lower mass, and partly due to less cantilevering)

2. Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.

3. Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.

4. Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)

5. Lower initial cost and time of setting up for mass production, using automated equipment.