Active Member
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[China]
Address: 2F Building C Feiteng Industrial Park, No. 8 HuanZhen Road Shajing Town ShenZhen 518104, China
Contact name:David
Fujintai Technology Co., Ltd. |
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FUJI SMT Placement Machines KE - 3020V Flex Chip With Second Hand
Description:
The KE-3020V is JUKI's latest leading-edge technology for improved
flexibility and production quality. It supports both electronic and
mechanical tape feeders and can handle boards up to 610 x 560 mm.
With its multi-nozzle laser head, the KE-3020V can achieve a rated
IPC9850 speed of 17,100 cph and is capable of a component placement
range from 01005 to 74 x 74 mm.
Features:
♦ Single Gantry, 1 Head per Gantry
Ideal for high-mix, high-changeover, environments.
♦ 6 Nozzles per Gantry(plus IC Head on 3020V)
It can place 6 components simultaneously and center on
the fly.
♦ High Accuracy Low Noise Ball Screw Drive With Linear Encoders
♦ High Accuracy Laser Align Component Centering
Select centering method based on component type, ship,
size and material.
♦ High Speed Strobing Vision Centering System(3020V only)
On-the-flying-vision centering increase placement
speed by eliminating wasted stops over camera.
♦ Quick Change Feeder Trolleys
Supports both electronic and mechanical feeder
trolleys.
♦ Standard POP Capacibility
Package-on-package assembly is fully supported using
either linear or rotary fluxer units.
Specifications:
| Placement head | ♦ Multi-nozzle laser head (6 nozzles) |
| Placement rate (max.) | ♦ 17,100 cph laser centering (IPC 9850) |
| Component range | ♦ 01005 - 74 x 74mm or 50 x 150mm |
| Placement accuracy | ♦ ±50μm(Cpk ≥ 1) laser centering |
| Board dimension (max.) | ♦ 610 x 560mm |
| Feeder Inputs | ♦ Max.160 in case of 8mm tape (on an electric double tape feeder) |
SMT Application:
Surface mount technology, SMT and its associated surface mount
devices, SMDs considerably speed up PCB assembly as the components
simply mount on the board.
Look inside any piece of commercially made electronic equipment
these days and it is filled with minute devices. Rather than using
traditional components with wire leads like those that may be used
for home construction and kits, these components are mounted onto
the surface of the boards and many are minute in size.
♦ Good mechanical performance under shock and vibration conditions. (Partly due to lower mass, and partly due to less cantilevering.)
♦ Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
♦ Better EMC performance(lower radiated emissions) due to the smaller radiation loop area(because of the smaller package) and the lesser lead inductance.
♦ Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
♦ Reasonable initial cost and time of setting up for mass production, using automated equipments.
