SOP-210 Automatic Multi Tube Burner 10 In 11 Out With Oblique Back Design

SOP-210 automatic multi-tube burner (10 in 11 out) oblique back

SSOP-210 automatic single tube burner (1 in 2 out) oblique back
Product introduction:
The APG01-Xx series of automatic burning machines are designed for the burning and testing of chips for factories, solution companies, chip sales and production companies. The product adopts microcomputer control, which has the advantages of high efficiency and low error rate, and solves the problem of low efficiency and high defect rate which most companies currently use for manual burning. The product adopts LCD liquid crystal Chinese display, which is simple and intuitive, easy to operate and affordable.

Single tube automatic burner

SSOP-150 automatic single tube burner automatic single tube burner automatic single tube burner
product information:

Product Name: Single tube automatic burner
Brand: Gongshun
Model: APG01-Xx
Support chip: It is mainly used for chips of 3, 6, 8, 10, 14, 18, 20, 24, 28, 32 pins in DIP/SDIP/SOP/SSOP/TSSOP package.

1 input and 2 output automatic burner details:

The APG01-Xx series of automatic burning machines are designed for the burning and testing of chips for factories, solution companies, chip sales and production companies. The product adopts microcomputer control, which has the advantages of high efficiency and low error rate, and solves the problem of low efficiency and high defect rate which most companies currently use for manual burning. The automatic burning machine adopts LCD liquid crystal Chinese display, which is simple and intuitive, convenient to operate and affordable.
The APG01-Xx series is a fully automatic programming and testing automation equipment with 1 tube and 2 tubes. You can set to burn and test one IC or two ICs each time. Treatment efficiency: 1500PCS/hour or more, one machine replaces the workload of three people, saving a lot of workers' wage costs. Mainly applicable to chips of 3, 6, 8, 10, 14, 18, 20, 24, 28, 32 pins in DIP/SDIP/SOP/SSOP/TSSOP packages. The automatic burning machine can be equipped with a burner of various manufacturers on the market.

The APG01-Xx series ic automatic burning machine model and chip support package are as follows:
◇ APG01-D1: Supports DIP300mil package IC with pin spacing of 1.27mm.
◇ APG01-D2: Supports DIP300mil package IC with pin spacing of 2.54mm.
◇ APG01-S1: Supports SOP300mil package IC with 1.27mm pin pitch.
◇ APG01-S2: Supports SOP150mil package IC with 1.27mm pin pitch.
◇ APG01-S3: Supports SOP209mil package IC with 1.27mm pin pitch.
◇ APG01-R1: Supports SSOP150mil package IC with 0.65mm pin pitch.
◇ APG01-T1: Supports TSSOP173mil package IC with pin pitch 0.65mm.
◇ APG01-T2: Supports TSSOP209mil package IC with pin pitch 0.65mm.
◇ Our company can also customize APG01-Xx IC automatic burning machine according to customer's specific requirements.

1 input and 2 output automatic burner specifications:

Size: L300*W300*H400mm
Weight: 15KG
Color: beige
Suitable for chips: DIP/SOP/SSOP/TSSOP
Input voltage: 220VAC 50HZ
Input line length: 150CM
Input plug: three feet (national standard GB2099)
Power: 100W (working full load maximum power)
Working temperature: 0°C-+40°C
Working humidity: 20%-90% R.H
Storage temperature: -20 ° C - +75 ° C
Storage humidity: 20%-90% R.H