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High Speed JUKI SMT Machine

Shenzhen Xinyinglong Electronic Technology Co., Ltd.
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Address: Shenzhen baoan district airdropping street 152 exhibition city community JingFang road industrial park plant F 203

Contact name:Jing-liang Zhang

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Shenzhen Xinyinglong Electronic Technology Co., Ltd.

High Speed JUKI SMT Machine

Country/Region china
City & Province shenzhen
Categories Electronics Production Machinery
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Product Details

JUKI KE - 3010 increase the speed of pallet supply components to improve production efficiency:

 

The high-speed placement machine "KE-3010" is an upgraded version of the "KE-2070". It is also the first model in the KE series that supports the use of electric feeders for chip placement machines. The high-speed general-purpose placement machine "KE-3020V/3020VR" is a successor model to the "KE-3020/3020R" model that can mount various components. While inheriting the advantages of the KE series, the mounting speed is greatly increased. The machine adopts "high-speed uninterrupted image recognition" technology, and its IC component placement speed is 63% higher than previous models. In addition, the machine adopts the newly developed high-speed pallet server, which can shorten the pallet replacement time, so it can greatly increase the speed of pallet supply components, so as to achieve the purpose of improving production efficiency.

 

■Chip Components
23,500CPH chip (laser recognition/best condition)
18,500CPH chip (laser recognition/according to IPC9850)
■IC components
■9,000CPH IC (Image recognition/when using MNVC option)
■0402 (Inch 01005) chip~33.5mm square element
■Laser placement head×1 (6 nozzles)
■Using electric dual-track feeder, up to 160 kinds of components can be loaded.
■High-speed continuous image recognition (option)

■Corresponding to long size substrates (option)

 

 

Specifications of JUKI high-speed universal placement machine KE-3010:

Substrate sizeL-Wide type substrate (510×360mm)*1
L-shaped substrate (410mm×360mm)
L-Wide type substrate (510×360mm)*1
XL type substrate (610mm×560mm)
Long substrate (L-shaped substrate specification) *2800×360mm
Long board (L-Wide type board specification) *21,010×360mm
Long board (XL type board specification) *21,210×560mm
Component height12mm specification
20mm specification
25mm specification
Component sizeLaser recognition0402 (British 01005) chip~33.5mm square element
Withdrawal recognitionStandard camera3mm~74mm square element, or 50×150mm

High resolution camera

(All are optional)

1.0mm×0.5mm*3~48mm square element, or 24×72mm
Component placement speedChip componentscondition20,900CPH
IPC985017,100CPH
IC component*49,470CPH *5
Component placement accuracyLaser recognition±0.05mm(Cpk≧1)
Image Identification±0.03mm(MNVC±0.04mm)
Component placement type160 types (converted to 8mm tape (when using an electric dual-track tape feeder)) *6

 

 


Siemens placement machine, FUJI Fuji placement machine, Panasonic placement machine, Universal Placement machine, Yamaha placement machine, /KNS placement machine MeiluMPM printing machine, Koh Young SPI, Easa reflow soldering, HELLER reflow

Supply all original new and used SIEMENS nozzle at good price Shenzhen Xinyinglong Electronic Technology Co., Ltd focuses on providing electronic manufacturers with the following SMT equipment:

AOI, Vitronics Soltec reflow soldering, non-standard automation equipment, placement machine rental leasing

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