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Multi Function FR4 Multilayer PCB Lead Free HASL OSP Surface

Shenzhen Zhongtenghuakong Technology Co., Ltd.

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Address: C204, Shizhiding Park, Pinghu Street, Longgang District, Shenzhen, Guangdong, China

Contact name:Yann Hu

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Shenzhen Zhongtenghuakong Technology Co., Ltd.

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Multi Function FR4 Multilayer PCB Lead Free HASL OSP Surface

Country/Region china
City & Province shenzhen guangdong
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Product Details

Product Description

Ultrasonic Mist Maker Pcba OEM LED USB Electronics Multilayer Printed Circuit Board

 

Files and Requirment for PCB,PCBA quotation:

  • A BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
  • PCB Gerber files.
  • A PCB fabrication drawing and PCBA assembly drawing.
  • Test procedures.
  • Any mechanical restrictions such as assembly height requirements
  • PCB board manufacture and PCBA service:
    • o PCB board made, circuit board parts purchased by us
    • o Electronic testing circuit board or PCBA
    • o Fast delivery, anti-static package
    • o RoHS Directive-compliant, lead-free
    • o One stop service from PCB design, PCB layout, PCB manufacture, components purchasing, PCB assembly, test, packing and PCB delivery
    • o Eleectronic manufacturing service
  • Detailed terms for PCB assembly:
    • o Technical requirement:
      • § Professional surface-mounting and through-hole soldering technology
      • § Various sizes like 1206, 0805, 0603 components SMT technology
      • § ICT (In Circuit Test), FCT (Functional Circuit Test) technology
      • § PCB assembly with UL, CE, FCC, RoHS approval
      • § Nitrogen gas reflow soldering technology for SMT
      • § High standard SMT and solder assembly line
      • § High density interconnected board placement technology capacity
    • o Quote requirement:
      • § Gerber file and Bom list
      • § Clear pics of pcba or pcba sample for us
      • § Test method for PCBA
    • o PCB specification:
      • § Layer: 1 to 12 layers
      • § Material: FR-4, CEM-1, CEM-3, Hight TG, FR4 halogen free, FR-1, FR-2,Aluminum etc.
      • § Max. finished thickness: 0.2 to 4.0mm (0.02 ~ 0.25)
      • § Max. finished board side: 500 x 500mm (20 x 20”)
      • § Min. drilled hole size: 0.25mm (10mil)
      • § Min. line width: 0.10mm (4mil)
      • § Min. line spacing: 0.10mm (4mil)
      • § Surface finish/treatment: HALS/HALS lead free, chemical tin, chemical gold, immersion gold, plating gold
      • § Copper thickness: 0.5 to 3.0 oz
      • § Solder mask color: green/black/white/red/blue
      • § Inner packing: plastic bag
      • § Outer packing: standard carton packing
      • § Hole tolerance: PTH: ±0.076, NTPH: ±0.05
      • § Certificate: UL, ISO 9001, ISO 14001, RoHS,UL
      • § Profiling punching: routing, V-cut, beveling
      • § Providing OEM service to all sorts of printed circuit board assembly
 Power 380v50Hz
 Transfer speed 0.5-0.6m/min
 Base Material FR-4/HTG150-180
 Copper Thickness 0.5oz-5oz
 Board Thickness 1.6mm
 Surface Finishing Lead Free HASL/OSP,Etc
 Feature 100% compatible
 Package Vacuum Package
 Insulation Resistance <50ohm
 Layer-layer misregistration 0.25mm(10mil)max

 

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