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Thermal Conductive 1:1 Mix Ratio Liquid Silicone Encapsulant RTV160 Elastomer Kit For Electronics Potting
Product Description
Silicone Encapsulant 160 Silicone Elastomer is a two component,
room temperature or heat curing encapsulant that is used for
general potting applications of power supplies. It has good
flowability, moderate thermal conductivity, and flame resistance.
Typical Use
General potting applications: power supplies, connectors, sensors,
industrial controls, transformers, amplifiers, high voltage
resistor packs, relays.
BENEFITS
Rapid, versatile cure processing controlled by temperature
Can be considered for uses requiring added flame resistance
Features
Easy mix with 1:1 proportion
Low viscosity, good flow ability
Room temperature cure or heat up cure
Thermal conduction, flame resistance
Without solvent
Using Instructions of Electronic Potting Silicone Compound& Encapsulates
1. Preparing: clean up the coating surface, remove the rust, dust, oil dirt.
2. Pouring: weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.
3. Curing: room temperature cure or heat-up cure is both workable.
It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contactwithmoisture in the air.
Technical datasheet of Electronic Potting Silicone Compound& Encapsulates
| Item No. | RTV160 |
| Before curing | |
| Appearance | A: brick red B: transparent |
| Viscosity (mPa.s 25°C) | 3000~6000 |
| Density (g/cm3 ) | 1.57±0.02 |
| Working life (min 25°C) | 30 |
| Curing time (hrs) | 24 |
| Heat-up at 100°C (min) | 10 |
| After curing | |
| Hardness (shore A) | 50~60 |
| Dielectric breakdown voltage kv/mm 25°C | ≥20 |
| Volume resistivity ohm*cm | 1*1015 |
| Tensile Strength Mpa | ≥0.6 |
| Thermal conductivity cm/°C | 0.525*10-3 |
| Working temperature °C | -30~200 |
Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.
MIXING AND DE-AIRING
These products are supplied in a 1 to 1 mix ratio, which is very
robust in manufacturing environments and allows for some process
and dispense equipment variation. In most cases de-airing is not
required.
PREPARING SURFACES
In applications requiring adhesion, priming will be required for
many of the silicone encapsulants. For best results, the primer
should be applied in a very thin, uniform coating and then wiped
off after application. After application, it should be thoroughly
cured prior to application of the silicone encapsulant. .
Additional instructions for primer usage can be found in the
information sheets specific to the individual primers.
Packaging of Electronic Potting Silicone Encapsulates
Packs are available in 20kg and 200kg per drum.
Storage & Transportation of Electronic Potting Silicone Encapsulates
Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
It can be stroked and transported as non-dangerous goods.
