Active Member
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[China]
Address: 5th Floor, B2 Building Research Center Songshan Lake Intelligent Valley, Liaobu Town, Dongguan City, Guangdong Province.
Contact name:Violet
GENITEC DONGGUAN CO.,LTD |
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Genitec 20μm PCB Laser Cutting Machine for SMT ZMLS5000DP
High Accuracy Aluminum Laser Cutting Machine For FPC/ PCB Cutting ZMLS5000DP
Product Description
1. With control software with independent intellectual property rights, user-friendly interface,
complete functions, simple operation;
2. Can process any graphics, cutting different thicknesses and
different materials can be processed
and the synchronization is complete hierarchical; optical system design optimization to ensure high beam quality,
reduce the focused spot size, to ensure precision;
3. Using high-performance UV laser with wave length, high beam
quality, higher peak power characteristics.
Due to ultraviolet light through decomposition, vaporization rather than melting materials processing to achieve,
so almost no post-processing glitches, small thermal effect, no points.
Layer, the effect of cutting precision, smooth, steep
sidewalls.
4. Using vacuum fixed sample, no mold protection plate is fixed,
convenient, improve processing efficiency.
5. Can cut a variety of substrate materials, such as: silicon,
ceramic, glass and the like.
6. Automatic correction, automatic positioning function,
multi-plate cutting,
automatic thickness measurement and compensation, motor Bank and compensation,
working better uniformity and small machining depth fluctuations, higher processing efficiency of complex graphics.
FPC UV laser cutting machine, FPC laser cutting
machine Technical parameters:
Solid-state UV laser source laser wavelength: 355nm
Specification
| Item | ZMLS5000DP |
| Machine size(L*W*H) | 1680*1650*1800mm |
| Weight | 2000KG |
| Power supply | Single Phase AC220V/3KW |
| Laser source | PS Laser/NS Laser |
| Laser power | 15W/20W (Optional) |
| Material thickness | ≦1.6mm (According to material) |
| Whole machine precision | ±20 μm |
| positioning precision | ±2 μm |
| Repeat precision | ±2 μm |
| Processing size | 350mm*450mm*2 |
| Focus spot diameter | 20 ± 5 μm |
| Environment temperature/humidity | 20±2 °C/<60% |
| Machine tool body | Marble |
| Galvanometer system | Original imported |
| Motion controlling system | Original imported |
| Formats | Gerber,DXF, ASCII, Excellon I and II, sieb&Meier |
| Necessary hardware and software | Including PC and CAM software |
| Working mode | Manual loading and unloading |
1. MicroScan5000DP laser cutting machine, dual platform, greatly improve production efficiency,
is specially designed for FPC and PCB processing equipment.
2. Efficient and fast FPC/PCB shape cutting, drilling and covering
film window opening,
fingerprint identification chip cutting, TF memory card board, mobile phone camera module cutting and other applications.
3. Block, layer, designated block or selected area cutting and
direct molding, cutting edge neat round,
smooth no burr, no glue overflow.
4. The product can be arranged in multiple matrix for automatic positioning and cutting,
especially suitable for fine, difficult, complex patterns and other shapes of cutting.
