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2 Inch Sapphire Double Side Polished Wafer 430um 0.1mm 0.2mm

Chongqing Silian Optoelectronic Science & Technology Co., Ltd.
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Address: No.99 Tong Xi Road, Caijia Town, Beibei District, Chongqing,China

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Chongqing Silian Optoelectronic Science & Technology Co., Ltd.

2 Inch Sapphire Double Side Polished Wafer 430um 0.1mm 0.2mm

Country/Region china
City & Province chongqing chongqing
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Product Details

Thickness 430um 0.1mm 0.2mm 2inch sapphire double side polished wafer

 

Description

 

Sapphire optical windows are ideal for applications where high pressure, vacuum, or corrosive atmospheres are a consideration. Sapphire, a single crystal form of Al2O3, is resistant to attack by strong acids due to its high dielectric constant. It has high compressive strength and a high melting point. It is also resistant to UV radiation darkening.

 

Specification

 

Crystal OrientationC-plane (0001) miscut to M
Mis-Orientation Towards Laser Mark0.3° off axis ± 0.1° Towards M plane (90° away from major flat assumed to be cut along an a-plane) Away from the r (102) direction
Mis Orientation Towards Primary Flat0° ± 0.1°
Wafer Diameter50.8± 0.05mm
Thickness430± 20mm
Major Flat16.0mm ± 1.0mm
Major Flat LocationA-axis ± 0.3°
Front SurfaceEpi Polish< 0.3nm
Backside Roughness<1micron
TTV£ 10mm
Warp£ 10mm
Bow£ 10mm
Edge ConditionEdge defect not to exceed SEMI M3-91,Table 2
Substrate Laser MarkingStandard Backside, parallel to flat
PackagingClass 100 clean room environment, in cassettes of 25, under a nitrogen atmosphere

 

The 2 inch DSP double side polished sapphire substrates can be manufactured from high quality optical grade Kyropoulos grown sapphire crystals.

high purity single crystal sapphire epitaxial substrate is suitable for direct epitaxial process, PSS process, ALN process and other epitaxial methods. It has the characteristics of uniform wavelength, high brightness and small STD. we can accept product customization for the technical specifications, and produce sapphire single / double polishing substrates with different external dimensions based on C (0001), a (11-20) and m (1100) crystal orientations, with notch or straight edge crystal orientations.

 

Process Flow

 

 

 

 

 

 

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