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10136590-101LF High Speed Modular Connectors VS2 3X8 RH SM 1S/G RF Interconnects

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10136590-101LF High Speed Modular Connectors VS2 3X8 RH SM 1S/G RF Interconnects

Country/Region china
City & Province shenzhen guangdong
Categories Active Components
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Product Details

10136590-101LFHigh Speed / Modular Connectors VS2 3X8 RH SM 1S/G 
Amphenol
Product Category:High Speed / Modular Connectors
72 Position
9 Row
2 mm
Press Fit
PwrBlade
Bulk
Brand:Amphenol FCI
Contact Material:Copper Alloy
Housing Material:Thermoplastic (TP)
Mounting Angle:Right Angle
Product Type:High Speed / Modular Connectors
Subcategory:Backplane Connectors
Tradename:PwrBlade

 

Description

AirMax VS2® connectors provide a migration path from AirMaxVS® for speeds up to 20Gb/s, providing

margin of safety fortypical 802.3ap system performance with the flexibility ofan open pin field design.

The connectors leverage AirMax VS®and VSe® design features and technology to achieve improvedsignal

integrity and mechanical attributes compared to AirMaxVS® connectors.

The connector utilizes FCI technology for a shieldless designwith no metallic plates and closely coupled

differential pairdesign to yield low loss and low crosstalk.AirMax VS2® connectors are mating-compatible

to both AirMaxVS® and AirMax VSe® connectors and require no changes toconnector PCB footprints.

The mating-compatible interfacesand capability to preserve critical pin assignments can provide opportunities

for cost savings as new and upgraded equipmentis deployed. For example, a backplane or chassis can

bedesigned to allow the installation and continued use of legacydaughter cards, line cards, or blades that

are already in thefield as well as new or future higher-speed module cards.Right angle and vertical

receptacles and headers supportbackplane, midplane and coplanar applications.

 

FEATURES

●Provides a migration path to 20Gb/s per differential pair

●Shieldless design with closely coupled pairs
●Backward mateable to existing VS andVS2 designs
●3, 4 and 5 pair backplane and coplanar versions are available
●Available with 0.5mm or 0.4mm compliant pins
●Hard metric design practice
 
BENEFITS
●Enables users to upgrade systems for higher performance in the same form factor
●Cost-effective solution yields low XT and Insertion Loss
●Drop in upgrade to previous generation systems
●Same product covers a wide range of customer applications
●0.5mm vias provide a drop-in replacement forVS parts
Improved SI with the 0.4mm tails, same as V5e
Can mix-and-match with other metric power and guidance components to create the precise system
 configuration that is needed

 

TECHNICAL INFORMATION

MATERIALS

• Contacts: High performance Copper Alloy

• Contact Finish:

• Performance-based plating at separable interface(Telcordia GR-1217-CORE Central Office)

• Tin over Nickel on press-fit tails

• Tin-lead option

• Housings: High Performance Thermoplastic, 94-V0

• Plating GXT+™

 

ELECTRICAL PERFORMANCES

• Contact Resistance: ≤60 mΩ initial in backplaneapplication, ≤120 mΩ initial in coplanar application

• Current Rating (with ≤30°C temperature rise aboveambient): 0.5 A/contact with all contacts powered

• Insertion Loss Performance: see graph below

• Crosstalk Performance: see graph belowENVIRONMENTAL

• Telcordia GR-1217-CORE Central Office qualification passedMECHANICAL PERFORMANCE

• Durability: 200 cycles• Mating Force: 0.50N max./contact

• Unmating Force: 0.15N min./contact• Average Compliant Pin Insertion Force/pin:

• 0.4mm PCB hole: 15N max.

• 0.5mm PCB hole: 30N max.

 

 

 

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