Bicheng Electronics Technology Co., Ltd |
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Introducing our high-performance Multilayer PCB built on FR408HR.This Multilayer PCB is designed for applications that demand maximum thermal performance and reliability. Crafted using Isola's patented high-performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric, this PCB offers exceptional properties that bridge the gap between thermal and electrical perspectives.
Key Features:
- Dielectric Constant (Dk): Boasting a Dk of 3.65 at 10GHz, this
PCB ensures excellent signal integrity and reliable performance in
high-frequency applications.
- Dissipation Factor: With a dissipation factor of 0.0095 at 10GHz,
it minimizes signal loss, providing efficient power transmission.
- Coefficient of Thermal Expansion (CTE): The CTE of 16 ppm/°C in
both the x and y axes ensures compatibility with copper, reducing
thermal stress and enhancing reliability.
- Thermal Stability: Featuring a high glass transition temperature
(Tg) of 230°C (DMA) and a decomposition temperature (Td) of 360°C
(TGA), this PCB exhibits exceptional thermal stability.
- Multiple Lamination Cycles: It can withstand multiple lamination
cycles, providing flexibility in the PCB manufacturing process.
- Lead-Free Assembly Compatibility: Designed to be compatible with
lead-free assembly processes, ensuring compliance with modern
industry standards.
- Via Filling Capability: This PCB supports via filling, enhancing
electrical connectivity and improving signal integrity.
- CAF Resistance: With superior resistance to Conductive Anodic
Filament (CAF) formation, it ensures long-term reliability and
performance.
- Moisture Resistance: The FR408HR exhibits superior moisture resistance during reflow, safeguarding against environmental factors.
PCB Stackup:
This PCB is a 4-layer rigid PCB with the following stackup:
- Top Layer: 35 μm copper
- Prepreg: 152 μm
- Inner Layer 1: 35 μm copper
- FR408HR Core: 1.535 mm
- Inner Layer 2: 35 μm copper
- Prepreg: 152 μm
- Bottom Layer: 35 μm copper
PCB Construction Details:
- Dimensions: 170mm x 130mm (1PCS), with a tolerance of +/- 0.15mm
- Minimum Trace/Space: 4/5 mils, enabling precise circuit design
and layout
- Minimum Hole Size: 0.3mm, supporting fine-pitch components and
high-density interconnects
- Blind Vias: Allowing for complex routing and efficient use of
available space
- Finished Board Thickness: 2.0mm, providing structural integrity
and durability
- Finished Copper Weight: 1oz (1.4 mils) on outer layers, ensuring
optimal conductivity
- Via Plating Thickness: 20 μm, facilitating reliable electrical
connections
- Surface Finish: Immersion Gold, offering excellent solderability
and corrosion resistance
- Silkscreen: Top layer in white, providing component and labeling
information
- Solder Mask: Red on both top and bottom layers, protecting copper
traces and preventing solder bridges
- Filled and Capped Vias: Enhancing signal integrity and improving
overall PCB performance
- 100% Electrical Test: Each PCB undergoes a comprehensive
electrical test prior to shipment, ensuring functionality and
quality.
PCB Statistics:
- Components: 270
- Total Pads: 320
- Thru Hole Pads: 150
- Top SMT Pads: 99
- Bottom SMT Pads: 71
- Vias: 78
- Nets: 6
Quality Standard and Availability:
- Quality Standard: This Multilayer PCB complies with IPC-Class-2
quality standards, ensuring high reliability and performance.
- Availability: This high-performance PCB is available worldwide, meeting the needs of diverse industries and applications.
Typical Applications:
This Multilayer PCB finds its application in various industries,
including:
- Consumer Electronics: From smartphones to audio/video equipment,
this PCB supports the demanding requirements of modern consumer
electronic devices.
- Server and Workstation: It provides the necessary performance and
reliability for high-end server and workstation applications.
- Automotive: The FR408HR PCB is suitable for automotive electronics, offering robustness and thermal stability in challenging automotive environments.