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[China]
Trade Verify
Address: Room 502, Block A, No.10 Hongguang Road, Yunpu Street, Huangpu District, Guangzhou City (Office only),China
Contact name:Paul Yang
Guangdong Autofor Precision Intelligent Technology Co., Ltd. |
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Verified Suppliers
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AUTOFOR centrifuge High centrifugal force type for high precision removal of granular sludge
Made in China World Quality
High centrifugal force type for high precision removal of granular sludge
Reuse of multiple cutting wire saw cutting fluid for cutting silicon wafers
Centrifugal force: 2200G, filtration accuracy 1-5 microns
Compared with other domestic brands: 30% increase
The industry's highest level of high-speed rotary separation and filtration of fine particles in coolant.
Features:
1. High-efficiency separation and filtration
Maximum speed (4000rpm), maximum centrifugal force (2200G) Powerful separation and filtration capabilities, to achieve efficient separation and filtration.
2. Powerful separation and filtration
The sludge is strongly dehydrated and can be recovered with a low moisture content.
size:
| item | AUTOFOR-500 | AUTOFOR-1600 | ||
| power | three phaze 200V 50/60HZ | |||
| Appropriate delivery volume | 20～40L/min | 70～140L/min | ||
| Max. RPM | 4000rmp | 2800rmp | ||
| Centrifugal force | 2200G | |||
| capacitance | MAIN POWER | 5.5kw | 7.5kw | |
| Gear motor | 0.2kw | |||
| sewage pump | 0.40kW | 0.75kW | ||
| Required air pressure | 0.5MPa | |||
performance
※ Performance test conditions
[Test sample] Glass grinding slag (specific gravity 2.5)
Average particle diameter 2.3μm [test solution] water
| sample | SS concentrati | Removal rate |
| Sewage | 8461mg/L | ‐ |
| Filtered cleaning liquid (new model) | 2105mg/L | 75％ |
Particle size distribution chart
use:
Silicon processing
Various processes such as solar cells, semiconductor wafer materials, multilayer wire saw processing, band saw processing, etc.
Sapphire and glass processing
Various processing such as LED substrates, various processing such as hard disk glass substrates, polishing processing, internal and external processing, etc.
Various machine tools
Gun-hole drilling machines, boring machines, electrical discharge machines, precision grinders, electrolytic grinders, gear grinders, washing machines, cutting machines, centerless machines, double-head machines and other equipment for grinding, purification of grinding processing fluid, and chip recycling
[Introduction example] Wafer processing
The presence or absence of the centrifuge causes the SS concentration in the auxiliary tank to change
离心机的有无引起附属槽的SS浓度变化
※ Results of performance tests performed by our company
Introduction effect
Low-level stabilization of SS concentration; reusable working fluid to reduce operating costs; no need to change working fluids to reduce labor costs; stable processing
