Beijing Guangtian Runze Technology Co., Ltd. |
Verified Suppliers
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Processor | Up to two 3rd Generation Intel Xeon Scalable processors, with up to
40 cores per processor | ||
Memory | • 32 DDR4 DIMM slots, supports RDIMM 2 TB max or LRDIMM 4 TB max,
speeds up to 3200 MT/s • Up to 16 Intel Persistent Memory 200 series (BPS) slots, 8 TB max • Supports registered ECC DDR4 DIMMs only | ||
Storage controllers | • Internal controllers: PERC H745, HBA355I, S150, H345, H755, H755N • Boot Optimized Storage Subsystem (BOSS-S2): HW RAID 2 x M.2 SSDs 240 GB or 480 GB • External PERC (RAID): PERC H840, HBA355E | ||
Drive Bays | Front bays: • Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 153 TB • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 64 TB • Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 122.8 TB Rear bays: • Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 30.7 TB | ||
Power Supplies | • 800 W Platinum AC/240 HVDC • 1100 W Titanium AC/240 HVDC • 1400 W Platinum AC/240 HVDC | ||
Form Factor | 1U rack server | ||
Embedded Management | • iDRAC9 • iDRAC Service Module • iDRAC Direct • Quick Sync 2 wireless module | ||
OpenManage Software | • OpenManage Enterprise • OpenManage Power Manager plugin • OpenManage SupportAssist plugin • OpenManage Update Manager plugin | ||
Embedded NIC | 2 x 1 GbE LOM | ||
Network Options | 1 x OCP 3.0 (x8 PCIe lanes) | ||
PCIe | Up to 3 x PCIe Gen4 low profile slots (all x16 except one x8 slot
with SNAP I/O modules) or 2 x PCIe (Gen4) full height slots | ||
CPU | Xeon 6326 | ||
Memory | 1024GB DDR4 | ||
Hard Drive | 8*960GSAS | ||
RAID Controller | H755 | ||
Power Supply | 1400W | ||
Chassis | 12*3.5in |