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Blind And Buried Via HDI Rigid Flex Pcb Multilayer ATF 16949

IBE ELectronics Co.,LTD
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IBE ELectronics Co.,LTD

Blind And Buried Via HDI Rigid Flex Pcb Multilayer ATF 16949

Country/Region china
Categories Adhesives & Sealants
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Product Details

 

Our Advantages:

 

1, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam.

 

2, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test

 

3, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce

 

4, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,

 

 

1MaterialPR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2Board ThicknessMass Production:0.3-3.5mm Samples:0.21-6.0mm
3Surface FinishHASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4PCB Panel SizeMax Mass Productoin: 610x460mm Sample:762x508mm
5LayerMass production:2-58 Layers, Samples:1-64 Layers
6Min. Drill Hole SizeLaser Drill 0.1mm,Machine Drill 0.2mm
7PCBA QCX-ray,AOI Test,Functional Test
8SpecialityAutomotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9SanforizedBuried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control

 

PCBA Capability

The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ),
EMS capacity can reach 150,000,000 components per month.

Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can
be cut and delivered inside of 4 hours.

PCB Assembly Capability
Stencil size range:1560*450mm
Min SMT package:0402/1005(1.0x0.5mm)
Min IC pitch:0.3mm
Max PCB Size:1200*400mm
Min PCB thickness:0.35mm
Min Chip Size:01005
Max BGA Size:74*74mm
BGA Ball Pitch:1.00~3.00mm
BGA Ball Diameter:0.4~1.0mm
QFP Lead Pitch:0.38~2.54mm
Testing :ICT,AOI,X-RAY,Funtional test etc.

 

Delivery Time:
 
Order Conditions
Standard Delivery Date
The fastest Delivery Date
Prototype ( <20pcs)
2days
8hours
Small Volume (20-100pcs)
6days
12hours
Medium Volume (100-1000)
3days
24hours
Mass Production (>1000)
Depends on BOM
Depends on BOM
 
 

FAQ:
1. What’s a motherboard?

A motherboard is a printed circuit assembly(PCA) used exclusively in laptop or desktop computers. While some may refer to a PCA as a motherboard,only those found in computers are motherboards. All other printed circuit assemblies are simply PCA or PCBA.
2.How does a printed circuit board assembly (PCB assembly) work?

The primary function of a PCB assembly is to integrate the electronic components of a device into a compact or defined space. Acting as the central hub of the electronic circuit of a device, the PCB provides insulation for all other electrical components, allowing them to be safely connected to a power source.
 

3. What information is required for a turnkey PCB assembly order?

For turnkey projects, we’ll need the following:
Gerber file
Bill of materials (BOM)
Component placement list (CPL)
All relevant CAD and .stp file
 

4. Are you UL / Underwriters Laboratory approved?

IBE pursues all applicable UL certifications for our products, and we offer several products certified with UL and CSA based on customer’s demand
Underwriters Laboratories (UL) grants multiple certifications, including:
IBE is certified for PCB by UL file E326838
 

5. Do you offer RoHS&REACH-compliant assemblies?
Yes, IBE does offer assemblies that comply with the European Union’s Restriction of Hazardous Substances (RoHS) Directive and REACH.

 
6. Do you offer testing and inspection services?
 
Yes, IBE offers a comprehensive list of testing and inspection services for both SMT and through-hole assemblies.
Visual inspection/scanning microscopes
AOI inspection
In-circuit test
Functional testing include automated test equipment and system
Burn-in tests
Low/High Temp Chamber Testing
X-ray inspection and repair
Salt fog tester
Drop Test
packing vibration
Conformal coating and potting
 

7. What are your PCB assembly standards?

IBE has obtained the following IPC electronics industry standards for PCB assembly
IPC-A-600G for PCB production
IPC-620 for practices and requirements for cables, wire, and harness assembly manufacturing
IPC-A-610E PCBA Acceptability of Electronic Assemblies
 
8.Where do you manufacture your products?
We have production plant based in shenzhen,China; Fremont,US,Bac Ninh,Vietn

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