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Edgebanding Woodworking Hot Melt Adhesives Foam Board -PUR-XBB768

WUXI WANLI ADHESION MATERIALS CO., LTD.

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Address: Changjiang South Road, No.17-17, Wuxi, Jiangsu 214000, CN

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Edgebanding Woodworking Hot Melt Adhesives Foam Board -PUR-XBB768

Country/Region china
City & Province wuxi jiangsu
Categories Adhesives & Sealants
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Product Details

Factory Supply Reactive PUR Hot Melt Glue for Edge Bonding of Foam Board to Various Surface Membrane, WANLI® PUR-XBB768 with Excellent Heat & Moisture Resistance

 

Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. It is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. It is featured good initial adhesion, suitable opening time, high bonding strength.

 

APPLICATION

Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. It is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.

 

Application MaterialWoodworking Edgebanding Hot Melt Adhesives
AppearanceIvory Solid
ComponentPUR (Polyurethane)
Application IndustryWoodworking Edgebanding
Solid Content100%
Operating Temperature120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt ViscosityAbout 55000mPa·s@120℃(Brookfield-ASTMD3236)
Open Time8~15s@25℃
Usage ScopeEdge Bonding of Foam Board
Shelf Life6 Months
Package2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel

 

FEATURE

Good initial adhesion, suitable opening time, high bonding strength

 

USER GUIDE

The package of PUR-XBB768 is suitable for various dispensing equipment. The recommended operating temperature is 120℃~140℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity).

 

STORAGE

Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.

 

 

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