|
[China]
Trade Verify
Address: 4F&2F, Building 1st, Nanchang Huafeng Industrial Park,NanchangCommunity, Xixiang Town, Baoan District, Shenzhen, China
Contact name:Yang
Shenzhen Sky-Win Technology Co., Ltd |
|
Verified Suppliers
|
|
|
HASL Lead Free 1.6mm Multilayer PCB Assembly Green Soldermask Industrial Printed Circuit Board
Industrial PCB Assembly Services
Sky Win Technology has become a one-stop solution when it comes to
high-quality industrial PCB assembly. Utilizing the latest
technology and equipped with a team of experts and industry best
practices, we ensure that we develop cutting-edge industrial
printed circuit board assemblies that are ahead of the curve.
Among our other products, we specialize in providing industrial PCB
assemblies that require a high level of reliability and precision.
Since electronics for industrial applications need to be extremely
stable and suitable for use in harsh conditions, industrial printed
circuit boards also need to adhere to strict standards to thrive in
industrial environments. Additionally, industrial PCBs need to be
able to withstand extreme temperatures, moisture and dust, shock,
vibration, and more.
We are able to provide solutions for a variety of industrial
applications, from sensing systems and monitors to heavy equipment
and home appliances. We are capable of providing low, medium and
high volume PCB assembly, complete machine assembly, cable and wire
harness assembly, complete turnkey assembly and many more solutions
for industrial applications.
Depending on the complexity of the circuit, we offer products
ranging from single layer PCBs to multi-layer PCBs. In addition,
different industrial applications require rigid and flexible
rigid-flex PCBs. You can rely on us to provide custom PCBs to meet
your customization needs.
Sky-Win PCB specializes in prototype and low volume PCB assembly,
SMT, Through Hole and Mixed Assembly
Passive Down to 01005 Sizes
Ball Grid Array (BGA)
Ultra-Fine Ball Grid Array (uBGA)
Quad Flat Pack No-Lead (QFN)
Quad Flat Package (QFP)
Plastic Leaded Chip Carrier (PLCC) 6. SOIC, Package-On-Package
(PoP)
Small Chip Packages (Pitch of 0.2 mm)
To get a full quotation of the Industrial PCB Assembly
Industrial PCB Assembly Process Capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
