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ENIG 1U LED Display 6 Layer PCB Black Solder Mask UL Certification 2.0 MM Thickness

Witgain Technology Limited
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Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111

Contact name:Steven YU

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Witgain Technology Limited

ENIG 1U LED Display 6 Layer PCB Black Solder Mask UL Certification 2.0 MM Thickness

Country/Region china
City & Province shenzhen
Categories Welding Helmets
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Product Details

6 Layer PCB Display Screen Used Black Solder Mask

 

 

 

Printed Circuit Board Features:

 

1  6 Layer printed circuit board used in display screen.

2  FR4 substrate material, tg 150 degree and board thickness is 2.0mm.

3  Black solder mask and white silkscreen.

4  OSP Treatment

5  PCB size is 748mm*90.4mm/1pcs.

6  35 um copper thcikness on each layer.

7  PCB file or gerber file should be offered by customer.

8  Customized printed circuit board.

 

 

Our history:

 

 

 

A grid testing machine has three building blocks - a fixture, a bed of nails and software, to control the overall functionality of the machine. It usually has two cameras which are placed on the top and bottom of the machine in order to scan the whole board.

Advantages of PCB Grid Testing:

  • Very Reliable method of PCB testing as all the points on the PCB board can be tested simultaneously.
  • Offers very good accuracy since it uses two cameras
  • Can easily detect manufacturing defects
  • An in-circuit tester is easy to program
  • Interpretation of test results is quite easy
  • It checks for Open, shorts, mission components, Wrong polarity, defective components, and current leakages in the circuit
  • Most of the parameters can be checked without applying power to the PCB under test

Limitations of PCB Grid Testing:

  • Fixtures used in bed of nails testing are expensive since they are mechanical and require a different wiring assembly for a different PCB board
  • Fixtures are mechanical so any change in the number of pins or their position require extra cost
  • This test doesn’t test continuity through connectors so there are the chances that the connectors’ faults may remain unnoticed.
  • Faults related to solder joints, excess solder, solder quality, and solder void also remain unidentified

This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.

 

 

 

 

 

 

 

 

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