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8 Layer Hdi Fr4 Circuit Board Enig Black Solder Mask Blind And Buried Holes

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Address: Block 11, International E-Commerce Logistic Center, PingHu Street, LongGang Distric, ShenZhen City

Contact name:Steven

8Layer HDI PCB, FR4, ENIG, BLACK SOLDER MASK , Blind And Buried Holes

8 Layer HDI PCB

PCB Specifications:

Layer Count: 8Layer HDI PCB

Board Thickness: 1.0MM

Material: FR4 High TG

Min Hole: 0.1MM

Min Line: 3/3 Mil

Hole: L1-L2, L2-L3, L3-L4, L4-L5, L5-L6, L6-L7, L7-L8, L1-L8

Solder Mask: Black

Surface Treatment: ENIG

Application: Consumer Electronics

Product Structure(Layer Count Distribution):

FAQ:

Question: How many lamination times for this 8 layer pcb?

Answer: There are in total 3 times lamination for this pcb.

Question: How many drilling times for this pcb?

Answer: There are in total 5 times drilling for this pcb.

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