OEM Custom Circuit Board Assembly Design Printed Circuit Assembly

Technical  Specification

Layers:

1~10 (flex Pcb)  and 2~8 (rigid flex)

Min Panel Size:

5mm x 8mm

Max Panel Size:

250 x 520mm

Min Finished board thickness:

0.05mm (1 sided inclusive copper)

Max Finished board thickness:

0.3mm (2 sided inclusive copper)

Finished board thickness tolerance:

±0.02~0.03mm

Material: 

Kapton, Polyimide, PET

Base copper thickness (RA or ED):

1/3 oz, 1/2 oz, 1oz, 2oz

Base PI thickness:

0.5mil, 0.7mil, 0.8mil, 1mil, 2mil

Stiffner:

Polyimide, PET, FR4, SUS

Min Finished hole diameter:

Φ 0.15mm

Max Finished hole diameter:

Φ 6.30mm

Finished hole diameter tolerance (PTH):

±2 mil ( ±0.050mm)

Finished hole diameter tolerance (NPTH):

±1 mil ( ±0.025mm)

Min width/spacing (1/3oz):

0.05mm/0.06mm

Min width/spacing (1/2oz):

0.06mm/0.07mm

Min width/spacing (1oz):

Single layer: 0.07mm/0.08mm

Double layer: 0.08mm/0.09mm

Aspect Ratio

6:01

8:01

Base Copper

1/3Oz--2Oz

3 Oz for Prototype

Size Tolerance

Conductor Width:±10%

W ≤0.5mm

Hole Size: ±0.05mm

H ≤1.5mm

Hole Registration: ±0.050mm

Outline Tolerance:±0.075mm

L ≤50mm

Surface Treatment

ENIG: 0.025um - 3um

OSP:

Immersion Tin: 0.04-1.5um

Dielectric Strength

AC500V

Solder Float

288℃/10s

IPC Standard

Peeling Strength

1.0kgf/cm

IPC-TM-650

Flammability

94V-O

UL94